SPRUJ10F May   2022  – January 2026

 

  1.   1
  2.   Description
  3.   Features
  4.   4
  5. 1Preface: Read This First
    1. 2.1 Sitara MCU+ Academy
    2. 2.2 If You Need Assistance
    3. 2.3 Important Usage Notes
  6. 2Kit Overview
    1. 3.1 Introduction
    2. 3.2 Kit Contents
    3. 3.3 Specification
      1. 3.3.1 Key Features
      2. 3.3.2 Component Identification
      3. 3.3.3 Functional Block Diagram
    4. 3.4 Device Information
    5. 3.5 BoosterPacks
    6. 3.6 Compliance
    7. 3.7 Security
  7. 3Board Setup
    1. 4.1 Power Requirements
      1. 4.1.1 Power Input Using USB Type-C Connector
      2. 4.1.2 Power Status LEDs
      3. 4.1.3 Power Tree
    2. 4.2 Push Buttons
    3. 4.3 Boot Mode Selection
  8. 4Hardware Description
    1. 5.1  Functional Block Diagram
    2. 5.2  GPIO Mapping
    3. 5.3  Reset
    4. 5.4  Clock
    5. 5.5  Memory Interface
      1. 5.5.1 QSPI
      2. 5.5.2 Board ID EEPROM
    6. 5.6  Ethernet Interface
      1. 5.6.1 Ethernet PHY #1 - CPSW RGMII/ICSSM
      2. 5.6.2 Ethernet PHY #2: CPSW RGMII/ICSSM
      3. 5.6.3 LED Indication in RJ45 Connector
    7. 5.7  I2C
    8. 5.8  Industrial Application LEDs
    9. 5.9  SPI
    10. 5.10 UART
    11. 5.11 MCAN
    12. 5.12 FSI
    13. 5.13 JTAG
    14. 5.14 Test Automation Header
    15. 5.15 LIN
    16. 5.16 MMC
    17. 5.17 ADC and DAC
    18. 5.18 EQEP and SDFM
    19. 5.19 EPWM
    20. 5.20 BoosterPack Headers
    21. 5.21 Pinmux Mapping
  9. 5EVM Revision Design Changes
    1. 6.1 Rev A Design Changes
  10. 6Hardware Design Files
  11. 7References
    1. 8.1 Reference Documents
    2. 8.2 Other TI Components Used in This Design
  12.   Trademarks
  13. 8Revision History

1.2 If You Need Assistance

If you have any feedback or questions, support for the Sitara MCUs and the AM263x LaunchPad development kit is provided by the TI Product Information Center (PIC) and the TI E2E™ Forum. Contact information for the PIC can be found on the TI website. Additional device-specific information can be found in the Reference Documents.