SNIA044 November   2021 TMP61 , TMP61-Q1 , TMP63 , TMP63-Q1 , TMP64 , TMP64-Q1

 

  1.   Trademarks
  2. 1Introduction
  3. 2Component Temperature Monitoring With Adjacent PCB Placement
  4. 3Component Temperature Monitoring Using Differential Techniques
    1. 3.1 Physics of Differential Temperature Measurements
    2. 3.2 Three-Point Differential Temperature Measurement
    3. 3.3 Differential Temperature Measurement Design Guidelines
      1. 3.3.1 Example: Differential Temperature Layout for a Power IC
  5. 4Summary
  6. 5References

4 Summary

High-accuracy component temperature monitoring is essential in applications where temperature compensation is needed, or where a system requires safety shutoff limits. This type of temperature monitoring, especially when components have die hot spots, can be done very well and at low cost by taking differential temperature measurements using two of TI’s TMP6 thermistors.

This style of design returns more accurate results than using the internal temperature sensor of the device or using a sensor placed adjacent to the device on the PCB. Differential temperature measurements can be considered when an intentional thermal layout for the two temperature sensors can be included in the design, and when other temperature-sensing techniques are not compatible with system design requirements.