SLVUC09 September   2021

 

  1.   Trademarks
  2. 1Introduction
    1. 1.1 Background
    2. 1.2 Performance Specification
    3. 1.3 Modifications
      1. 1.3.1 IC U1 Operation
      2. 1.3.2 Device Enable Evaluation
  3. 2Setup
    1. 2.1 Input/Output Connector and Header Descriptions
    2. 2.2 Setup
  4. 3Board Layout
    1. 3.1 Layout
  5. 4Schematic and Bill of Materials
    1. 4.1 Schematic
    2. 4.2 Bill of Materials

4.2 Bill of Materials

Table 4-1 TPS631000EVM-075 Bill of Materials
DESIGNATOR QTY VALUE DESCRIPTION PACKAGE REFERENCE PART NUMBER MANUFACTURER
C3, C4, C5 3 22 μF CAP, CERM, 22 μF, 10 V, ±20%, X5R, 0603 0603 GRM187R61A226ME15D MuRata
FID1, FID2, FID3 3 Fiducial mark. There is nothing to buy or mount. N/A N/A N/A
J1, J2 2 Header, 2.54 mm, 6 × 1, Gold, TH Header, 2.54 mm, 6 × 1, TH 61300611121 Wurth Elektronik
J3, J4 2 Header, 100 mil, 3 × 1, Tin, TH Header, 3 pin, 100 mil, Tin PEC03SAAN Sullins Connector Solutions
L1 1 1 μH Inductor, Shielded, Metal Composite, 1 µH, 3.2 A, 0.042 Ω, SMD 1008 DFE252012P-1R0M=P2 MuRata
R1 1 50 RES, 50, 0.1%, 0.05 W, 0402 0402 FC0402E50R0BTBST1 Vishay Thin Film
R2 1 560 k RES, 560 k, 5%, 0.063 W, AEC-Q200 Grade 0, 0402 0402 CRCW0402560KJNED Vishay-Dale
R3, R4, R5 3 100 k RES, 100 k, 1%, 0.1 W, 0402 0402 ERJ-2RKF1003X Panasonic
SH-JP1, SH-JP2 2 Shunt, 100 mil, Gold plated, Black Shunt 2 pos. 100 mil 881545-2 TE Connectivity
U1 1 High-Power Density 1-A Buck-Boost Converter SOT583 TPS631000DLR Texas Instruments
C1 0 150 μF CAP, TA, 150 uF, 10 V, ±10%, 0.1 Ω, SMD 7343-31 T495D157K010ATE100 Kemet
C2, C6 0 22 μF CAP, CERM, 22 μF, 10 V, ±20%, X5R, 0603 0603 GRM187R61A226ME15D MuRata
C7 0 10 pF CAP, CERM, 10 pF, 16 V, ±10%, C0G, 0402 0402 C0402C100K4GACTU Kemet
J5, J6 0 Header, 100 mil, 2x1, Gold, TH 2 × 1 Header TSW-102-07-G-S Samtec
TP1 0 Test Point, Compact, Grey, TH TestPoint, Grey, 220 mil, TH 5123 Keystone