SLUUCO1 July   2022 BQ25172

 

  1.   BQ25172EVM Evaluation Module
  2.   Trademarks
  3.   3
  4. 1Introduction
    1. 1.1 Printed Circuit Board Assembly
    2. 1.2 I/O Descriptions
  5. 2Test Summary
    1. 2.1 Equipment
    2. 2.2 Cautions
    3. 2.3 Test Instructions
  6. 3Board Layout, Schematic, and Bill of Materials
    1. 3.1 Board Layout
    2. 3.2 Schematic
    3. 3.3 Bill of Materials
  7. 4Revision History

Board Layout

The board layout is shown in Figure 3-1 to Figure 3-6.

GUID-60273DE4-A458-4570-9C02-54C94D13213D-low.pngFigure 3-1 Top Overlay
GUID-BB261E11-ED2C-4F26-9304-8B9E805CD87F-low.gifFigure 3-2 Top Solder
GUID-11C6E64C-2EC1-474D-A017-12EDCE7FF68A-low.gifFigure 3-3 Top Layer
GUID-D3872911-74B9-4788-8B6D-21AC66563E96-low.gifFigure 3-4 Bottom Layer
GUID-10B6099A-F620-4CE4-8983-D54F6970CCC8-low.gifFigure 3-5 Bottom Solder
GUID-20FE7F7A-FE14-4756-BD40-49E9C1351606-low.gifFigure 3-6 Bottom Overlay