SLUUAQ0C October   2013  – November 2021

 

  1.   Trademarks
  2. 1 Introduction
  3. 2 Description
    1. 2.1 Typical Applications
    2. 2.2 Features
  4. 3 Electrical Performance Specifications
  5. 4 Schematic
  6. 5 Test Setup
    1. 5.1 Test Equipment
    2. 5.2 Recommended Test Setup
      1. 5.2.1 Input Connections
      2. 5.2.2 Output Connections
  7. 6 Configurations
    1. 6.1 Switching Frequency Selection
    2. 6.2 Mode Selection
    3. 6.3 VDD Pin Supply Selection
  8. 7 Test Procedure
    1. 7.1 Line/Load Regulation and Efficiency Measurement Procedure
    2. 7.2 Control Loop Gain and Phase Measurement Procedure
    3. 7.3 List of Test Points
    4. 7.4 Equipment Shutdown
  9. 8 EVM Assembly Drawing and PCB Layout
  10. 9 List of Materials
  11. 10Revision History

EVM Assembly Drawing and PCB Layout

The following figures (Figure 8-1 through Figure 8-8) show the design of the TPS53513EVM-PWR587 printed circuit board. The EVM has been designed using 4 Layers, 2-oz copper circuit board.

GUID-030DD926-5322-4E92-8CCC-077FD573BE13-low.gifFigure 8-1 TPS53513EVM-587 Top Layer Assembly Drawing
GUID-FB5A2675-F226-4812-9925-E0D193D6597B-low.gifFigure 8-2 TPS53513EVM-587 Bottom Assembly Drawing
GUID-531BCDF3-DA1D-4C6C-B5B1-349A9E88854E-low.gifFigure 8-3 TPS53513EVM-587 Top Copper
GUID-A2FAAF19-25F1-40C8-BCAE-2EEC43F50B44-low.gifFigure 8-4 TPS53513EVM-587 Layer 2 Copper
GUID-279E1482-AD2B-46EF-A429-B7F3D05DF05F-low.gifFigure 8-5 TPS53513EVM-587 Layer 3 Copper
GUID-DE4E8FCE-685D-44E7-A3A1-40D10558B659-low.gifFigure 8-6 TPS53513EVM-587 Layer 4 Copper
GUID-0D1CF0F7-7F55-4669-9C5D-6097D9126844-low.gifFigure 8-7 TPS53513EVM-587 Layer 5 Copper
GUID-AFB94347-589B-42BB-BECC-F95800966C6F-low.gifFigure 8-8 TPS53513EVM-587 Bottom Layer Copper