SLUAAG6 June   2022 BQ25180

 

  1.   Abstract
  2.   Trademarks
  3. 1Introduction
  4. 2Features
  5. 3Test Results
  6. 4Thermal Results
  7. 5Board Design Files
    1. 5.1 BQ25180 Schematic
    2. 5.2 BQ25180 Bill of Materials
    3. 5.3 BQ25180 PCB Layers
    4. 5.4 BQ25181 Schematic
    5. 5.5 BQ25181 Bill of Materials
    6. 5.6 BQ25181 PCB Layers
  8. 6References

4 Thermal Results

The small form factor design of the BQ2518x boards were used to measure thermal dissipation using a thermal camera. The following data shows the thermal results for both boards design.

The BQ25181 shows a better thermal dissipation across the charge current (ICHG) range. The BQ25181 is typically 12°C/W better than the BQ25180 version at ambient (25°C) temperature while dissipating 1 watt across the die. Is important to point out this board design focus is to showcase and optimize solution size, in order to obtain better thermal performance in both devices some layout tradeoff could be implemented on your design. Refer to the data sheet for layout recommendations.

Figure 4-1 and Figure 4-2 shows the thermal results for the BQ25180 and BQ25181 at 1W dissipation, respectively.



IN =5 V, BAT=3.6 V, Thermal Regulation = Disable, T = 25°C, Power loss = 1 W, RƟJA = 50.5°C/W

Figure 4-1 BQ25180 Power Dissipation at 1 W


IN =5 V, BAT=3.6 V, Thermal Regulation = Disable, T = 25°C, Power loss = 1 W, RƟJA = 38.1°C/W

Figure 4-2 BQ25181 Power Dissipation at 1 W