SLUAAA3A September 2020 – June 2025 UCC2808A-1Q1 , UCC2808A-2Q1
This section provides functional safety failure in time (FIT) rates for UCC2808A-xQ1 based on two different industry-wide used reliability standards:
| FIT IEC TR 62380 / ISO 26262 | Power Dissipation (mW) | FIT (Failures Per 109 Hours) |
|---|---|---|
| Total component FIT rate | 75 | 10 |
| 150 | 11 | |
| 300 | 15 | |
| Die FIT rate | 75 | 3 |
| 150 | 4 | |
| 300 | 7 | |
| Package FIT rate | 75 | 7 |
| 150 | 7 | |
| 300 | 8 |
The failure rate and mission profile information in Table 2-1 comes from the reliability data handbook IEC TR 62380 / ISO 26262 part 11:
| Table | Category | Reference FIT Rate | Reference Virtual TJ |
|---|---|---|---|
| 5 | CMOS,
BICMOS Digital, analog, or mixed | 25 FIT | 55°C |
The reference FIT rate and reference virtual TJ (junction temperature) in Table 2-2 come from the Siemens Norm SN 29500-2 tables 1 through 5. Failure rates under operating conditions are calculated from the reference failure rate and virtual junction temperature using conversion information in SN 29500-2 section 4.