SLLA489A May   2020  – December 2025 ISO7021

 

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  2. 1Construction and Marking Report for ATEX / IECEx Certification
    1. 1.1 ISO7021 and ISO7021F Device Construction Information
    2. 1.2 Information About Pin Numbers and Pin Signal Names
    3. 1.3 Constructional Diagrams
    4. 1.4 Information About Creepage and Clearance Specification
    5. 1.5 Mechanical Data
    6. 1.6 Isolation Capacitor Technology
    7. 1.7 Assembly Information
    8. 1.8 ISO7021 and ISO7021F Device Marking Information
      1. 1.8.1 Location and Details of Marking on the IC
  3. 2Revision History

1.7 Assembly Information

This device uses molding compound CEL-8240HF10GK, which is manufactured by Hitachi. The composition of this molding compound is Epoxy Resin-1, Epoxy Resin-2, Phenol resin, Amorphous Silica, and Carbon Black. Minimum thermal conductivity of the compound is 15E-04cal/cm.S.°C. Gold bond wires are supplied by Tanaka; the bond wires have a diameter of 24.3µm. Similarly, mount compound, or adhesive, is CRM-1076WD which is supplied by Sumitomo.