SFFSBH0 July   2026 SN74CBTLV3245A-Q1

 

  1.   1
  2.   Trademarks
  3. 1Overview
  4. 2Functional Safety Failure In Time (FIT) Rates
  5. 3Failure Mode Distribution (FMD)
  6. 4Pin Failure Mode Analysis (Pin FMA)
    1. 4.1 TSSOP (20), VSSOP (20), and VQFN (20) Packages
  7. 5Revision History

4 Pin Failure Mode Analysis (Pin FMA)

This section provides a failure mode analysis (FMA) for the pins of the SN74CBTLV3245A-Q1 (TSSOP (20), VSSOP (20), and VQFN (20) packages). The failure modes covered in this document include the typical pin-by-pin failure scenarios:

  • Pin short-circuited to ground (see Table 4-2)
  • Pin open-circuited (see Table 4-3)
  • Pin short-circuited to an adjacent pin (see Table 4-4)
  • Pin short-circuited to VDD (see Table 4-5)

Table 4-2 through Table 4-5 also indicate how these pin conditions can affect the device as per the failure effects classification in Table 4-1.

Table 4-1 TI Classification of Failure Effects
ClassFailure Effects
APotential device damage that affects functionality.
BNo device damage, but loss of functionality.
CNo device damage, but performance degradation.
DNo device damage, no impact to functionality or performance.

Following are the assumptions of use and the device configuration assumed for the pin FMA in this section:

  • External pullup resistor on CS to VDD
  • RC filter on every analog input, AINx.
    Series resistors are sized to limit the input currents into the analog inputs to <10mA in all circumstances, for example, in cases where the device is not powered and an input signal is applied.
  • The device is the only target on the SPI bus.