SFFSBE8 June   2026 TLC69624-Q1 , TLC69634-Q1

 

  1.   1
  2.   Trademarks
  3. 1Overview
  4. 2Functional Safety Failure In Time (FIT) Rates
    1. 2.1 WQFN (32) Wettable flank Package
    2. 2.2 HTSSOP (32) Package
  5. 3Failure Mode Distribution (FMD)
  6. 4Pin Failure Mode Analysis (Pin FMA)
    1. 4.1 WQFN (32) Wettable flank Package
    2. 4.2 HTSSOP (32) Package
  7. 5Revision History

Pin Failure Mode Analysis (Pin FMA)

This section provides a failure mode analysis (FMA) for the pins of the TLC69624-Q1 and TLC69634-Q1 (WQFN (32) Wettable flank and HTSSOP (32) packages). The failure modes covered in this document include the typical pin-by-pin failure scenarios:

Table 4-2 through Table 4-9 also indicate how these pin conditions can affect the device as per the failure effects classification in Table 4-1.

Table 4-1 TI Classification of Failure Effects
ClassFailure Effects
APotential device damage that affects functionality.
BNo device damage, but loss of functionality.
CNo device damage, but performance degradation.
DNo device damage, no impact to functionality or performance.

Following are the assumptions of use and the device configuration assumed for the pin FMA in this section:

  • Special considerations on pin level tailoring: The OUT23 pin can be selected as either the constant-current sink channel or the FB function.