SFFSA73 December 2025 TPS61381-Q1
4 Pin Failure Mode Analysis (Pin FMA)
This section provides a failure mode analysis (FMA) for the pins of the TPS61381-Q1, TPS61382-Q1, TPS61383-Q1, and TPS61382A-Q1. The failure modes covered in this document include the typical pin-by-pin failure scenarios:
- Pin short-circuited to ground (see Table 4-2)
- Pin open-circuited (see Table 4-3)
- Pin short-circuited to an adjacent pin (see Table 4-4)
- Pin short-circuited to supply (see Table 4-5)
Table 4-2 through Table 4-5 also indicate how these pin conditions can affect the device as per the failure effects classification in Table 4-1.
Table 4-1 TI Classification of Failure Effects
| Class | Failure Effects |
|---|---|
| A | Potential device damage that affects functionality. |
| B | No device damage, but loss of functionality. |
| C | No device damage, but performance degradation. |
| D | No device damage, no impact to functionality or performance. |
Figure 4-1 shows the TPS61381-Q1, TPS61382-Q1, TPS61383-Q1, and TPS61382A-Q1 pin diagram. For a detailed description of the device pins, see the Pin Configuration and Functions section in the TPS61381-Q1, TPS61382-Q1, TPS61383-Q1, and TPS61382A-Q1 datasheets.
Figure 4-1 TPS61381-Q1, TPS61382-Q1, TPS61383-Q1, and
TPS61382A-Q1 Pin DiagramFollowing are the assumptions of use and the device configuration assumed for the pin FMA in this section:
- The device is operated within the Recommended Operating Conditions and the Absolute Maximum Ratings in the TPS61381-Q1, TPS61382-Q1, TPS61383-Q1, and TPS61382A-Q1 datasheets.
- The device is configured as shown in the Application and Implementation section in the TPS61381-Q1, TPS61382-Q1, TPS61383-Q1, and TPS61382A-Q1 datasheets.
Table 4-2 Pin FMA for Device Pins Short-Circuited to Ground
| Pin Name | Pin No. | Description of Potential Failure Effects | Failure Effect Class |
|---|---|---|---|
| BUB | 1 | The device stays in UVLO lockout. | B |
| COMP | 2 | Loop cannot regulate in boost mode. The VOUT pin drops below target. | B |
| AVI | 3 | There is no output signal for battery state-of-health (SOH) mode. The output of AVI pin is programmable by I2C interface. The device is damaged if the output of the AVI pin is programmed to BUB voltage and the output ratio is programmed to ratio = 1. | A |
| SCL | 4 | The device fails to connect the I2C registers. | B |
| SDA | 5 | The device fails to connect the I2C registers. | B |
| AGND | 6 | The layout parasitic inductance changes. Noise couples into the internal circuits. | C |
| EN_CHGR | 7 | The functions of the charger and SOH cannot be enabled. | B |
| STATUS | 8 | There is no STATUS indicator function. | B |
| VCC | 9 | The internal power supply of the device cannot be established. The device cannot operate. | B |
| LO | 10 | There is damage to the low-side driver. | A |
| VOUT | 11 | The device is damaged if the BST_SCP function of the I2C is not enabled. | A |
| VOUT | 12 | The device is damaged if the BST_SCP function of the I2C is not enabled. | A |
| VOUT | 13 | The device is damaged if the BST_SCP function of the I2C is not enabled. | A |
| VOUT | 14 | The device is damaged if the BST_SCP function of the I2C is not enabled. | A |
| SW | 15 | There is damage to the device. | A |
| SW | 16 | There is damage to the device. | A |
| SW | 17 | There is damage to the device. | A |
| IL | 18 | There is damage to the device. | A |
| IL | 19 | There is damage to the device. | A |
| IL | 20 | There is damage to the device. | A |
| IL | 21 | There is damage to the device. | A |
| BOOT | 22 | There is damage to the device. | A |
| EN_BST | 23 | The boost function cannot be enabled. | B |
| TS | 24 | TS_FAULT logic triggers, the device stops charging. | B |
| EP | 25 | The layout parasitic inductance changes. Noise couples into the internal circuits. | C |
Table 4-3 Pin FMA for Device Pins Open-Circuited
| Pin Name | Pin No. | Description of Potential Failure Effects | Failure Effect Class |
|---|---|---|---|
| BUB | 1 | There is no output voltage in boost mode. | B |
| COMP | 2 | The boost output is unstable. | B |
| AVI | 3 | There is no output signal for SOH mode. | A |
| SCL | 4 | The device fails to connect the I2C registers. | B |
| SDA | 5 | The device fails to connect the I2C registers. | B |
| AGND | 6 | The layout parasitic inductance changes. Noise couples into the internal circuits. | C |
| EN_CHGR | 7 | The functions of the charger and SOH cannot be enabled. | B |
| STATUS | 8 | There is no STATUS indicator function. | B |
| VCC | 9 | The capacitance of the VCC pin is not enough. The VCC pin cannot support a heavy load. | B |
| LO | 10 | There is damage to the device. | A |
| VOUT | 11 | There is damage to the device. | A |
| VOUT | 12 | There is damage to the device. | A |
| VOUT | 13 | There is damage to the device. | A |
| VOUT | 14 | There is damage to the device. | A |
| SW | 15 | There is damage to the device. | A |
| SW | 16 | There is damage to the device. | A |
| SW | 17 | There is damage to the device. | A |
| IL | 18 | There is damage to the device. | A |
| IL | 19 | There is damage to the device. | A |
| IL | 20 | There is damage to the device. | A |
| IL | 21 | There is damage to the device. | A |
| BOOT | 22 | The VOUT pin is out of regulation. | A |
| EN_BST | 23 | The boost function cannot be enabled. | B |
| TS | 24 | There is no temperature sense function. The charger and SOH report a FAULT for the TS pin. | B |
| EP | 25 | The layout parasitic inductance changes. Noise couples into the internal circuits. | C |
Table 4-4 Pin FMA for Device Pins Short-Circuited to Adjacent Pin
| Pin Name | Pin No. | Shorted to | Description of Potential Failure Effects | Failure Effect Class |
|---|---|---|---|---|
| BUB | 1 | TS | There is damage to the device when BUB > 6V. | A |
| COMP | 2 | BUB | There is damage to the device when BUB > 6V. | A |
| AVI | 3 | COMP | The output voltage is out of regulation. | B |
| SCL | 4 | AVI | The device fails to connect the I2C registers. | B |
| SDA | 5 | SCL | The device fails to connect the I2C registers. | B |
| AGND | 6 | SDA | The device fails to connect the I2C registers. | B |
| EN_CHGR | 7 | AGND | The functions of the charger and SOH cannot be enabled. | B |
| STATUS | 8 | EN_CHGR | The charger can turn off abnormally. | B |
| VCC | 9 | STATUS | There is an increase in VOUT leakage. | B |
| LO | 10 | VCC | The boost leg is shooting through. | A |
| VOUT | 11-14 | LO | There is damage to the driver. | A |
| SW | 15-17 | VOUT | There is damage to the driver. | A |
| IL | 18-21 | SW | There is damage to the driver. | A |
| BOOT | 22 | IL | There is damage to the driver. | A |
| EN_BST | 23 | BOOT | There is damage to the driver. | A |
| TS | 24 | EN_BST | The TS_FAULT logic triggers, the device stops charging. | B |
| EP | 25 | COMP | The device does not operate. The VCC pin is short. | B |
| EP | 25 | BUB | There is no output voltage in boost mode. | B |
| EP | 25 | AVI | There is no output signal for SOH mode. The device is damaged if the output of the AVI pin is programmed to BUB voltage and the output ratio is programmed to ratio = 1. | A |
| EP | 25 | SCL | The device fails to connect the I2C registers. | B |
Table 4-5 Pin FMA for Device Pins Short-Circuited to Supply
| Pin Name | Pin No. | Description of Potential Failure Effects | Failure Effect Class |
|---|---|---|---|
| BUB | 1 | There is damage to the device when the supply voltage is > 15V. | A |
| COMP | 2 | There is damage to the device when the supply voltage is > 6V. | A |
| AVI | 3 | There is damage to the device when the supply voltage is > 6V. | A |
| SCL | 4 | There is damage to the device when supply voltage > 6V. | B |
| SDA | 5 | There is damage to the device when the supply voltage is > 6V. | B |
| AGND | 6 | The device does not operate. The power supply is short. | C |
| EN_CHGR | 7 | There is damage to the device when the supply voltage is > 15V. | B |
| STATUS | 8 | There is damage to the device when the supply voltage is > 15V. | B |
| VCC | 9 | There is damage to the device when the supply voltage is > 6V. | B |
| LO | 10 | There is damage to the device when the supply voltage is > 6V. | A |
| VOUT | 11 | There is reverse current into the power supply in boost mode. There is no effect on the function of the device. | A |
| VOUT | 12 | There is reverse current into the power supply in boost mode. There is no effect on the function of the device. | A |
| VOUT | 13 | There is reverse current into the power supply in boost mode. There is no effect on the function of the device. | A |
| VOUT | 14 | There is reverse current into the power supply in boost mode. There is no effect on the function of the device. | A |
| SW | 15 | There is damage to the device. | A |
| SW | 16 | There is damage to the device. | A |
| SW | 17 | There is damage to the device. | A |
| IL | 18 | There is damage to the device. | A |
| IL | 19 | There is damage to the device. | A |
| IL | 20 | There is damage to the device. | A |
| IL | 21 | There is damage to the device. | A |
| BOOT | 22 | There is damage to the device when the supply voltage is > 6V in standby mode. | A |
| EN_BST | 23 | There is damage to the device when the supply voltage is > 15V. | B |
| TS | 24 | There is damage to the device when the supply voltage is > 6V. | B |
| EP | 25 | The device does not operate. The power supply is short. | C |