SFFS832A September   2024  – September 2026 UCC27301A-Q1 , UCC27311A-Q1

 

  1.   1
  2.   Trademarks
  3. 1Overview
  4. 2Functional Safety Failure In Time (FIT) Rates
    1. 2.1 SOIC Package
    2. 2.2 VSON Package
  5. 3Failure Mode Distribution (FMD)
  6. 4Pin Failure Mode Analysis (Pin FMA)
    1. 4.1 SOIC Package
    2. 4.2 VSON Package
  7. 5Revision History

Overview

This document contains information for the UCC273x1A-Q1 and UCC27302A-Q1 (SOIC and VSON packages) to aid in a functional safety system design. Only the VSON package product supports the EN function. Information provided are:

  • Functional safety failure in time (FIT) rates of the semiconductor component estimated by the application of industry reliability standards
  • Component failure modes and distribution (FMD) based on the primary function of the device
  • Pin failure mode analysis (pin FMA)

Figure 1-1, Figure 1-2, and Figure 1-3 show the device functional block diagrams for reference.

UCC27301A-Q1 UCC27311A-Q1 UCC27302A-Q1 Functional Block Diagram of  UCC27301A-Q1Figure 1-1 Functional Block Diagram of UCC27301A-Q1

Only the VSON package product supports the EN function.

UCC27301A-Q1 UCC27311A-Q1 UCC27302A-Q1 Functional Block Diagram of UCC27311A-Q1Figure 1-2 Functional Block Diagram of UCC27311A-Q1
UCC27301A-Q1 UCC27311A-Q1 UCC27302A-Q1 Functional Block Diagram of
                        UCC27302A-Q1 Figure 1-3 Functional Block Diagram of UCC27302A-Q1

The UCC273x1A-Q1 and UCC27302A-Q1 were developed using a quality-managed development process, but were not developed in accordance with the IEC 61508 or ISO 26262 standards.