SFFS832 Functional safety information | 德州仪器 TI.com.cn

SFFS832A September 2024 – September 2026 UCC27301A-Q1 , UCC27311A-Q1

2.1 SOIC Package

This section provides functional safety failure in time (FIT) rates for the SOIC package of the UCC273x1A-Q1 and UCC27302A-Q1 based on two different industry-wide used reliability standards:

Table 2-1 provides FIT rates based on IEC TR 62380 / ISO 26262 part 11
Table 2-2 provides FIT rates based on the Siemens Norm SN 29500-2

Table 2-1 UCC27301A-Q1 and UCC27302A-Q1 Component Failure Rates per IEC TR 62380 / ISO 26262 Part 11

FIT IEC TR 62380 / ISO 26262	Power Dissipation (mW)	FIT (Failures Per 10⁹ Hours)
Total component FIT rate	10	10
Total component FIT rate	400	11
Die FIT rate	10	3
Die FIT rate	400	4
Package FIT rate	10	7
Package FIT rate	400	7

The failure rate and mission profile information in Table 2-1 comes from the reliability data handbook IEC TR 62380 / ISO 26262 part 11:

Mission profile: Motor control from table 11 or figure 16
Power dissipation: 10mW, 400mW
Climate type: World-wide table 8 or figure 13
Package factor (lambda 3): Table 17b or figure 15
Substrate material: FR4
EOS FIT rate assumed: 0 FIT

Table 2-2 UCC27301A-Q1 and UCC27302A-Q1 Component Failure Rates per Siemens Norm SN 29500-2

Table	Category	Reference FIT Rate	Reference Virtual T_J
5	CMOS, BICMOS Digital, analog, or mixed	20 FIT	55°C

The reference FIT rate and reference virtual T_J (junction temperature) in Table 2-2 come from the Siemens Norm SN 29500-2 tables 1 through 5. Failure rates under operating conditions are calculated from the reference failure rate and virtual junction temperature using conversion information in SN 29500-2 section 4.