SFFS408 may   2023 TLV9022-Q1 , TLV9024-Q1 , TLV9032-Q1 , TLV9034-Q1

 

  1.   1
  2.   Trademarks
  3. 1Overview
  4. 2Functional Safety Failure In Time (FIT) Rates
    1. 2.1 DUAL Packages
    2. 2.2 QUAD Packages
  5. 3Failure Mode Distribution (FMD)
  6. 4Pin Failure Mode Analysis (Pin FMA)

Pin Failure Mode Analysis (Pin FMA)

This section provides a Failure Mode Analysis (FMA) for the pins of the TLV9044-Q1. The failure modes covered in this document include the typical pin-by-pin failure scenarios:

Table 4-2 through Table 4-5 also indicate how these pin conditions can affect the device as per the failure effects classification in Table 4-1 .

Table 4-1 TI Classification of Failure Effects
ClassFailure Effects
APotential device damage that affects functionality
BNo device damage, but loss of functionality
CNo device damage, but performance degradation
DNo device damage, no impact to functionality or performance

Figure 4-1 shows the TLV9044-Q1 pin diagram. For a detailed description of the device pins please refer to the 'Pin Configuration and Functions' section in the data sheet.

GUID-20200930-CA0I-FCB5-TBJR-28LG0TRKXTL6-low.gifFigure 4-1 Pin Diagram
Table 4-2 Pin FMA for Device Pins Short-Circuited to Ground
Pin Name Pin No. Description of Potential Failure Effects Failure Effect Class

OUT2

1

No change if GND pin is GND node B

OUT1

2

No change if GND pin is GND node B

V+

3

Main supply shorted out (no power to device) B

IN1-

4

Output goes high, if other input is positive B

IN1+

5

Output goes low, if other input is positive B

IN2-

6

Output goes high, if other input is positive B

IN2+

7

Output goes low, if other input is positive B

IN3-

8

Output goes high, if other input is positive B

IN3+

9

Output goes low, if other input is positive B

IN4-

10

Output goes high, if other input is positive B

IN4+

11

Output goes low, if other input is positive B

V-

12

No change if same node as GND D

OUT4

13

No change if GND pin is GND node B

OUT3

14

No change if GND pin is GND node B
Table 4-3 Pin FMA for Device Pins Open-Circuited
Pin NamePin No.Description of Potential Failure EffectsFailure Effect Class

OUT2

1

Output can't drive application loadB

OUT1

2

Output can't drive application loadB

V+

3

Main supply open (no power to device)B

IN1-

4

Output can be low or highB

IN1+

5

Output can be low or highB

IN1-

6

Output can be low or highB

IN2+

7

Output can be low or highB

IN3-

8

Output can be low or highB

IN3+

9

Output can be low or highB

IN4-

10

Output can be low or highB

IN4+

11

Output can be low or highB

V-

12

Lowest voltage pin drives GND pin internally (via diode)A

OUT4

13

Output can't drive application loadB

OUT3

14

Output can't drive application loadB
Table 4-4 Pin FMA for Device Pins Short-Circuited to Adjacent Pin
Pin NamePin No.Shorted toDescription of Potential Failure EffectsFailure Effect Class

OUT2

1

OUT1

Output can be low or highB

OUT1

2

V+

Thermal stress due to high power dissipationA

V+

3

IN1-

Output goes low, if other input is less positiveB

IN1-

4

IN1+

Output can be low or highB

IN1+

5

IN2-

Output can be low or highB

IN2-

6

IN2+

Output can be low or highB

IN2+

7

IN3-

Output can be low or highB

IN3-

8

IN3+

Output can be low or highB

IN3+

9

IN4-

Output can be low or highB

IN4-

10

IN4+

Output can be low or highB

IN4+

11

V-

Output goes low, if other input is positiveB

V-

12

OUT4

No change if GND pin is GND nodeB

OUT4

13

OUT3

Output can be low or highB

OUT3

14

OUT2

Output can be low or highB
Table 4-5 Pin FMA for Device Pins Short-Circuited to Supply
Pin Name Pin No. Description of Potential Failure Effects Failure Effect Class

OUT2

1

Thermal stress due to high power dissipation A

OUT1

2

Thermal stress due to high power dissipation A

V+

3

No change if same node as VCC D

IN1-

4

Output goes low, if other input is less positive B

IN1+

5

Output goes high, if other input is less positive B

IN2-

6

Output goes low, if other input is less positive B

IN2+

7

Output goes high, if other input is less positive B

IN3-

8

Output goes low, if other input is less positive B

IN3+

9

Output goes high, if other input is less positive B

IN4-

10

Output goes low, if other input is less positive B

IN4+

11

Output goes high, if other input is less positive B

V-

12

Main supply shorted out (no power to device) B

OUT4

13

Thermal stress due to high power dissipation A

OUT3

14

Thermal stress due to high power dissipation A