SFFS191C March   2022  – November 2025 UCC27200-Q1 , UCC27201A-Q1 , UCC27211A-Q1 , UCC27212A-Q1

 

  1.   1
  2.   Trademarks
  3. 1Overview
  4. 2Functional Safety Failure In Time (FIT) Rates
    1. 2.1 SOIC PowerPAD Package
    2. 2.2 SOIC Package
  5. 3Failure Mode Distribution (FMD)
  6. 4Pin Failure Mode Analysis (Pin FMA)
  7. 5Revision History

1 Overview

This document contains information for the following device and package combinations to aid in a functional safety system design:

  • UCC27200-Q1, UCC27201A-Q1, UCC27211A-Q1, and UCC27212A-Q1 (SOIC PowerPAD™ integrated circuit package)
  • UCC27211A-Q1 (SOIC package)

Information provided are:

  • Functional safety failure in time (FIT) rates of the semiconductor component estimated by the application of industry reliability standards
  • Component failure modes and distribution (FMD) based on the primary function of the device
  • Pin failure mode analysis (Pin FMA)

Figure 1-1 shows the device functional block diagram for reference.

UCC27200-Q1 UCC27202A-Q1 UCC27211A-Q1 UCC27212A-Q1 Functional Block Diagram Figure 1-1 Functional Block Diagram

UCC27200-Q1, UCC2720xA-Q1, and UCC2721xA-Q1 were developed using a quality-managed development process, but were not developed in accordance with the IEC 61508 or ISO 26262 standards.