SFFS191C March   2022  – November 2025 UCC27200-Q1 , UCC27201A-Q1 , UCC27211A-Q1 , UCC27212A-Q1

 

  1.   1
  2.   Trademarks
  3. 1Overview
  4. 2Functional Safety Failure In Time (FIT) Rates
    1. 2.1 SOIC PowerPAD Package
    2. 2.2 SOIC Package
  5. 3Failure Mode Distribution (FMD)
  6. 4Pin Failure Mode Analysis (Pin FMA)
  7. 5Revision History

3 Failure Mode Distribution (FMD)

The failure mode distribution estimation for UCC27200-Q1, UCC27201A-Q1, UCC27211A-Q1, and UCC27212A-Q1 in Table 3-1 comes from the combination of common failure modes listed in standards such as IEC 61508 and ISO 26262, the ratio of sub-circuit function size and complexity and from best engineering judgment.

The failure modes listed in this section reflect random failure events and do not include failures due to misuse or overstress.

Table 3-1 Die Failure Modes and Distribution
Die Failure Modes Failure Mode Distribution (%)
HO stuck low 16.3
HO stuck high 16.3
HO unknown or level is outside of specified level 16.3
LO stuck low 16.3
LO stuck high 16.3
LO unknown or level is outside of specified level 16.3
High side UVLO not functioning 1
Low side UVLO not functioning 1