SFFS167B september   2021  – july 2023 ADS117L11 , ADS127L11 , ADS127L21

 

  1.   1
  2.   Trademarks
  3. 1Overview
  4. 2Functional Safety Failure In Time (FIT) Rates
    1. 2.1 TSSOP Package
    2. 2.2 WQFN Package
  5. 3Failure Mode Distribution (FMD)
  6. 4Pin Failure Mode Analysis (Pin FMA)
    1. 4.1 TSSOP Package
    2. 4.2 WQFN Package
  7. 5Revision History

1 Overview

This document contains information for the ADS117L11 (WQFN package), ADS127L11 (TSSOP and WQFN packages), and ADS127L21 (WQFN package) to aid in a functional safety system design. Information provided are:

  • Functional safety failure in time (FIT) rates of the semiconductor component estimated by the application of industry reliability standards
  • Component failure modes and their distribution (FMD) based on the primary function of the device
  • Pin failure mode analysis (pin FMA)

Figure 1-1 shows the device functional block diagram for reference.

GUID-20221004-SS0I-QV4S-KXTC-W9Z38ZVGDRG1-low.svg Figure 1-1 Functional Block Diagram

The ADS117L11, ADS127L11, and ADS127L21 were developed using a quality-managed development process, but were not developed in accordance with the IEC 61508 or ISO 26262 standards.