SFFS028A June   2022  – November 2025 TMP112-Q1

 

  1.   1
  2.   Trademarks
  3. 1Overview
  4. 2Functional Safety Failure In Time (FIT) Rates
    1. 2.1 SOT563-6 Package
    2. 2.2 X2SON-5 Package
  5. 3Failure Mode Distribution (FMD)
  6. 4Pin Failure Mode Analysis (Pin FMA)
    1. 4.1 SOT563-6 Package
    2. 4.2 X2SON-5 Package
  7. 5Revision History

1 Overview

This document contains information for TMP112-Q1 and TMP112D-Q1 (SOT563-6 and X2SON-5 packages) to aid in a functional safety system design. Information provided are:

  • Functional safety failure in time (FIT) rates of the semiconductor component estimated by the application of industry reliability standards
  • Component failure modes and distribution (FMD) based on the primary function of the device
  • Pin failure mode analysis (pin FMA)

Figure 1-1 shows the device functional block diagram for reference.

TMP112-Q1 TMP112D-Q1 Functional Block Diagram Figure 1-1 Functional Block Diagram

TMP112-Q1 and TMP112D-Q1 were developed using a quality-managed development process, but were not developed in accordance with the IEC 61508 or ISO 26262 standards.