SBAK044 February   2026 DAC39RF10-SP

 

  1.   1
  2.   Abstract
  3.   Trademarks
  4. 1Texas Instruments Product Qualification and Reliability Report
  5. 2Space Grade MLS Production Flow
  6. 3Device Qualification
  7. 4Outgas Test Report
  8. 5Construction Exceptions and Manufacturing Flow Optimizations

3 Device Qualification

The following is the device qualification summary.

Qualification by Similarity (Qualification Family)

A new device can be qualified either by performing full-scale quality and reliability tests on the actual device or using previously qualified devices through qualification by similarity (QBS) rules. By establishing similarity between the new device and those qualified previously, repetitive tests are eliminated, allowing for timely production release. When adopting QBS methodology, the emphasis is on qualifying the differences between a previously qualified product and the new product under consideration.

The QBS rules for a technology, product, test parameters or package shall define which attributes are required to remain fixed for the QBS rules to apply. The attributes which are expected and allowed to vary are reviewed and a QBS plan shall be developed, based on the reliability impact assessment above, specifying what subset of the full complement of environmental stresses is required to evaluate the reliability impact of those variations. Each new device shall be reviewed for conformance to the QBS rule sets applicable to that device.

See JEDEC JESD47 for more information.

Table 3-1 Device Overview
TI DeviceDAC39RF10ACL-MLSAssembly SiteAMKOR (KOREA)
Wafer FabTSMC F12Test SiteTI-PHI (Phillipines)
Fab ProcessTSMC C014.P

CMOS 40nm

Pin and Package typeACL,

256

Fab TechnologyTSMC C014.P

CMOS 40nm

Substrate Bump FinishPb Free SOP/uBall
Die Revision

B

Substrate Pad FinishSnAgCu
ESD CDM±250VChip Cap Termination

Pure Sn

ESD HBM±1000VMoisture SensitivityMSL 3/ 220°C
Table 3-2 Space Products New Device Qualification Matrix
Req nameMethod / ConditionsLots / DevicesSS / Accept
Precon MSL3MSL3 220°C

3

120/0
UHAST (110°C)110C/85%RH, 264, 528 Hours

3

30/0
BHAST (110°C)110C/85%RH, 264, 528 Hours

3

30/0
HTSL (150°C)150C, 1000 Hours

3

30/0
Temperature Cycle-55C/125C, 1000 cycles

3

30/0
Solderability22 leads/lot, min 3 devices. 245C + 5C Condition A (steam age for 8 hours)13/0
Physical DimensionsPer case outline drawing115/0
D3 per QCI planPrecon MSL3, 220C b) JESD22-A104, -55/125C, 1000 cycles c) JESD22-A118, 110C/85%RH, 264 hours115/0
D4 per QCI plan

Per MIL-PRF-38535M Table V

1

15/0

D5 Salt Atmosphere, per QCI planCondition A, per 883 TM1009115/0
ESD CDMJS-002, 250V13/0
ESD HBMJS-001, 1KV13/0
Latch-Up HTJESD78, 150C13/0
C1 - Life Test, 125°CTM1005 125C, 1000 Hours145/0
Outgassing CharacterizationASTM E595
TML <=1%
CVCM <=0.1%		-PASS
Thermal Resistance QMLSimulation-See Data sheet / Complete
Radiation Response CharacterizationTotal ionization dose, single-event latch-up MIL-STD-883/Method 10191Complete (Refer to radiation report on www.ti.com)