SBAK044 February   2026 DAC39RF10-SP

 

  1.   1
  2.   Abstract
  3.   Trademarks
  4. 1Texas Instruments Product Qualification and Reliability Report
  5. 2Space Grade MLS Production Flow
  6. 3Device Qualification
  7. 4Outgas Test Report
  8. 5Construction Exceptions and Manufacturing Flow Optimizations

2 Space Grade MLS Production Flow

Device Introduction

DAC39RF10-SP is a radiation hardened device in a plastic flip-chip package that is suitable for space applications. The 17 × 17mm 256ACL package utilizes internal lead-free die-bumps (with underfill) and eutectic tin-lead external BGA balls.

The device was verified immune to 120 MeV·cm2/mg at 125°C for single event latch-up (SEL). Each fabrication lot is tested according to MIL-STD-883 for Radiation Lot Acceptance Tested (RLAT) up to 300 krad(Si) and each assembly and test lot follows the process flow shown in Figure 2-1. To maintain the quality and reliability of DAC39RF10-SP, it has been tested and qualified to meet space-grade requirements. See Section 3 for further details.

DAC39RF10-SP Screening Flow Figure 2-1 DAC39RF10-SP Screening Flow