ZHCSK14E November   2007  – July 2019 VCA824

PRODUCTION DATA.  

  1. 1 特性
  2. 2 应用
  3. 3 说明
    1.     Device Images
      1.      差分均衡器
      2.      RC 负载的差分均衡过程
  4. 4 修订历史记录
  5. 5 Device Comparison Table
  6. 6 Pin Configuration and Functions
    1.     Pin Functions
  7. 7 Specifications
    1. 7.1 Absolute Maximum Ratings
    2. 7.2 ESD Ratings
    3. 7.3 Recommended Operating Conditions
    4. 7.4 Thermal Information
    5. 7.5 Electrical Characteristics: VS = ±5 V
    6. 7.6 Typical Characteristics: VS = ±5 V, AVMAX = 2 V/V
    7. 7.7 Typical Characteristics: VS = ±5 V, AVMAX = 10 V/V
    8. 7.8 Typical Characteristics: VS = ±5 V, AVMAX = 40 V/V
  8. 8 Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagram
    3. 8.3 Feature Description
    4. 8.4 Device Functional Modes
      1. 8.4.1 Maximum Gain Of Operation
      2. 8.4.2 Output Current And Voltage
      3. 8.4.3 Input Voltage Dynamic Range
      4. 8.4.4 Output Voltage Dynamic Range
      5. 8.4.5 Bandwidth
      6. 8.4.6 Offset Adjustment
      7. 8.4.7 Noise
      8. 8.4.8 Input and ESD Protection
  9. 9 Application and Implementation
    1. 9.1 Application Information
      1. 9.1.1 Difference Amplifier
      2. 9.1.2 Differential Equalizer
      3. 9.1.3 Differential Cable Equalizer
      4. 9.1.4 Voltage-Controlled Lowpass Filter [application sub]
      5. 9.1.5 Wideband Variable Gain Amplifier Operation
    2. 9.2 Typical Application
      1. 9.2.1 Design Requirements
      2. 9.2.2 Detailed Design Procedure
      3. 9.2.3 Application Curve
  10. 10Power Supply Recommendations
  11. 11Layout
    1. 11.1 Layout Guidelines
      1. 11.1.1 Thermal Considerations
    2. 11.2 Layout Example
  12. 12器件和文档支持
    1. 12.1 器件支持
      1. 12.1.1 开发支持
        1. 12.1.1.1 演示板
    2. 12.2 接收文档更新通知
    3. 12.3 社区资源
    4. 12.4 商标
    5. 12.5 静电放电警告
    6. 12.6 Glossary
  13. 13机械、封装和可订购信息

封装选项

机械数据 (封装 | 引脚)
散热焊盘机械数据 (封装 | 引脚)
订购信息

12.5 静电放电警告

esds-image

ESD 可能会损坏该集成电路。德州仪器 (TI) 建议通过适当的预防措施处理所有集成电路。如果不遵守正确的处理措施和安装程序 , 可能会损坏集成电路。

ESD 的损坏小至导致微小的性能降级 , 大至整个器件故障。 精密的集成电路可能更容易受到损坏 , 这是因为非常细微的参数更改都可能会导致器件与其发布的规格不相符。