ZHCSK14E November   2007  – July 2019 VCA824

PRODUCTION DATA.  

  1. 1 特性
  2. 2 应用
  3. 3 说明
    1.     Device Images
      1.      差分均衡器
      2.      RC 负载的差分均衡过程
  4. 4 修订历史记录
  5. 5 Device Comparison Table
  6. 6 Pin Configuration and Functions
    1.     Pin Functions
  7. 7 Specifications
    1. 7.1 Absolute Maximum Ratings
    2. 7.2 ESD Ratings
    3. 7.3 Recommended Operating Conditions
    4. 7.4 Thermal Information
    5. 7.5 Electrical Characteristics: VS = ±5 V
    6. 7.6 Typical Characteristics: VS = ±5 V, AVMAX = 2 V/V
    7. 7.7 Typical Characteristics: VS = ±5 V, AVMAX = 10 V/V
    8. 7.8 Typical Characteristics: VS = ±5 V, AVMAX = 40 V/V
  8. 8 Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagram
    3. 8.3 Feature Description
    4. 8.4 Device Functional Modes
      1. 8.4.1 Maximum Gain Of Operation
      2. 8.4.2 Output Current And Voltage
      3. 8.4.3 Input Voltage Dynamic Range
      4. 8.4.4 Output Voltage Dynamic Range
      5. 8.4.5 Bandwidth
      6. 8.4.6 Offset Adjustment
      7. 8.4.7 Noise
      8. 8.4.8 Input and ESD Protection
  9. 9 Application and Implementation
    1. 9.1 Application Information
      1. 9.1.1 Difference Amplifier
      2. 9.1.2 Differential Equalizer
      3. 9.1.3 Differential Cable Equalizer
      4. 9.1.4 Voltage-Controlled Lowpass Filter [application sub]
      5. 9.1.5 Wideband Variable Gain Amplifier Operation
    2. 9.2 Typical Application
      1. 9.2.1 Design Requirements
      2. 9.2.2 Detailed Design Procedure
      3. 9.2.3 Application Curve
  10. 10Power Supply Recommendations
  11. 11Layout
    1. 11.1 Layout Guidelines
      1. 11.1.1 Thermal Considerations
    2. 11.2 Layout Example
  12. 12器件和文档支持
    1. 12.1 器件支持
      1. 12.1.1 开发支持
        1. 12.1.1.1 演示板
    2. 12.2 接收文档更新通知
    3. 12.3 社区资源
    4. 12.4 商标
    5. 12.5 静电放电警告
    6. 12.6 Glossary
  13. 13机械、封装和可订购信息

封装选项

机械数据 (封装 | 引脚)
散热焊盘机械数据 (封装 | 引脚)
订购信息

11.1.1 Thermal Considerations

The VCA824 does not require heatsinking or airflow in most applications. The maximum desired junction temperature sets the maximum allowed internal power dissipation as described in this section. In no case should the maximum junction temperature be allowed to exceed 150°C.

Operating junction temperature (TJ) is given by Equation 12:

Equation 12. VCA824 q_tj_bos394.gif

The total internal power dissipation (PD) is the sum of quiescent power (PDQ) and additional power dissipated in the output stage (PDL) to deliver load power. Quiescent power is simply the specified no-load supply current times the total supply voltage across the part. PDL depends on the required output signal and load; for a grounded resistive load, however, it is at a maximum when the output is fixed at a voltage equal to one-half of either supply voltage (for equal bipolar supplies). Under this worst-case condition, PDL = VS2/(4 × RL), where RL is the resistive load.

Note that it is the power in the output stage and not in the load that determines internal power dissipation. As a worst-case example, compute the maximum TJ using a VCA824ID (SO-14 package) in the circuit of Figure 75 operating at maximum gain and at the maximum specified ambient temperature of 85°C.

Equation 13. VCA824 q_pd_bos394.gif
Equation 14. VCA824 q_max_tj_bos394.gif

This maximum operating junction temperature is well below most system level targets. Most applications should be lower because an absolute worst-case output stage power was assumed in this calculation of VCC/2, which is beyond the output voltage range for the VCA824.