ZHCS846B April   2012  – June  2015 ULN2003LV

PRODUCTION DATA.  

  1. 1 特性
  2. 2 应用
  3. 3 说明
  4. 4 修订历史记录
  5. 5 Pin Configuration and Functions
  6. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
    6. 6.6 Switching Characteristics
    7. 6.7 Dissipation Ratings
    8. 6.8 Typical Characteristics
  7. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1 TTL and Other Logic Inputs
      2. 7.3.2 Input RC Snubber
      3. 7.3.3 High-Impedance Input Drivers
    4. 7.4 Device Functional Modes
  8. 8 Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Application
      1. 8.2.1 Design Requirements
      2. 8.2.2 Detailed Design Procedure
      3. 8.2.3 Application Curve
    3. 8.3 System Examples
      1. 8.3.1 Max Supply Selector
      2. 8.3.2 Constant Current Generation
      3. 8.3.3 Unipolar Stepper Motor Driver
      4. 8.3.4 NOR Logic Driver
      5. 8.3.5 1.8-V Relay Driver
  9. 9 Power Supply Recommendations
  10. 10Layout
    1. 10.1 Layout Guidelines
    2. 10.2 Layout Example
    3. 10.3 On-Chip Power Dissipation
    4. 10.4 Thermal Considerations
      1. 10.4.1 Improving Package Thermal Performance
  11. 11器件和文档支持
    1. 11.1 社区资源
    2. 11.2 商标
    3. 11.3 静电放电警告
    4. 11.4 Glossary
  12. 12机械、封装和可订购信息

封装选项

机械数据 (封装 | 引脚)
散热焊盘机械数据 (封装 | 引脚)
订购信息

9 Power Supply Recommendations

The COM pin is the power supply pin of this device to power the gate drive circuitry. Although not required but depending on the power supply, TI recommends to put a bypass capacitor of 100 nF across the Vcom pin and Gnd.