ZHCSGC2F June   2017  – January 2019 UCC5310 , UCC5320 , UCC5350 , UCC5390

PRODUCTION DATA.  

  1. 特性
  2. 应用
  3. 说明
    1. 3.1 功能框图(S、E 和 M 版本)
  4. 修订历史记录
  5. Device Comparison Table
  6. Pin Configuration and Function
    1.     Pin Functions
  7. Specifications
    1. 7.1  Absolute Maximum Ratings
    2. 7.2  ESD Ratings
    3. 7.3  Recommended Operating Conditions
    4. 7.4  Thermal Information
    5. 7.5  Power Ratings
    6. 7.6  Insulation Specifications for D Package
    7. 7.7  Insulation Specifications for DWV Package
    8. 7.8  Safety-Related Certifications For D Package
    9. 7.9  Safety-Related Certifications For DWV Package
    10. 7.10 Safety Limiting Values
    11. 7.11 Electrical Characteristics
    12. 7.12 Switching Characteristics
    13. 7.13 Insulation Characteristics Curves
    14. 7.14 Typical Characteristics
  8. Parameter Measurement Information
    1. 8.1 Propagation Delay, Inverting, and Noninverting Configuration
      1. 8.1.1 CMTI Testing
  9. Detailed Description
    1. 9.1 Overview
    2. 9.2 Functional Block Diagram
    3. 9.3 Feature Description
      1. 9.3.1 Power Supply
      2. 9.3.2 Input Stage
      3. 9.3.3 Output Stage
      4. 9.3.4 Protection Features
        1. 9.3.4.1 Undervoltage Lockout (UVLO)
        2. 9.3.4.2 Active Pulldown
        3. 9.3.4.3 Short-Circuit Clamping
        4. 9.3.4.4 Active Miller Clamp (UCC53x0M)
    4. 9.4 Device Functional Modes
      1. 9.4.1 ESD Structure
  10. 10Application and Implementation
    1. 10.1 Application Information
    2. 10.2 Typical Application
      1. 10.2.1 Design Requirements
      2. 10.2.2 Detailed Design Procedure
        1. 10.2.2.1 Designing IN+ and IN– Input Filter
        2. 10.2.2.2 Gate-Driver Output Resistor
        3. 10.2.2.3 Estimate Gate-Driver Power Loss
        4. 10.2.2.4 Estimating Junction Temperature
      3. 10.2.3 Selecting VCC1 and VCC2 Capacitors
        1. 10.2.3.1 Selecting a VCC1 Capacitor
        2. 10.2.3.2 Selecting a VCC2 Capacitor
        3. 10.2.3.3 Application Circuits With Output Stage Negative Bias
      4. 10.2.4 Application Curve
  11. 11Power Supply Recommendations
  12. 12Layout
    1. 12.1 Layout Guidelines
    2. 12.2 Layout Example
    3. 12.3 PCB Material
  13. 13器件和文档支持
    1. 13.1 文档支持
      1. 13.1.1 相关文档
    2. 13.2 认证
    3. 13.3 相关链接
    4. 13.4 接收文档更新通知
    5. 13.5 社区资源
    6. 13.6 商标
    7. 13.7 静电放电警告
    8. 13.8 术语表
  14. 14机械、封装和可订购信息

封装选项

机械数据 (封装 | 引脚)
散热焊盘机械数据 (封装 | 引脚)
订购信息

修订历史记录

Changes from E Revision (October 2018) to F Revision

  • Deleted 从第 2 个项目中删除了“(UCC5390EC)”。现在有三个已发行的宽体器件Go
  • Added 在“安全相关认证”中添加了“DIN EN 61010-1”Go
  • Added 在整个“安全相关认证”项目中添加了“(计划)”Go
  • Changed 在“说明”中使用开关类型信息更改了“引脚配置和驱动强度 型号”Go
  • Changed creepage and clearance from 9 mm to 8.5 mm in Insulation Specifications and throughout datasheetGo
  • Added VDE and CQC certification for D package and UL file number for DWV package Go
  • Changed test condition for VOHGo
  • Changed a minor detail to the UCC53x0M figuresGo
  • Changed typical application circuit for E Version to include capacitors on negative bias Go

Changes from D Revision (May 2018) to E Revision

  • Changed UCC5310 DWV package from Preview to Final.Go
  • Changed UCC5320 DWV package from Preview to Final.Go

Changes from C Revision (February 2018) to D Revision

  • Changed 将 UCC5390EC 的销售状态从“预览”更改成了“生产”。Go

Changes from B Revision (August 2017) to C Revision

  • Added 将 UCC5350SBD、UCC5320SCDWV、UCC5310MCDWV 和 UCC5390ECDWV 器件添加至数据表 Go
  • Changed 特性、 应用、 说明和功能框图,以包括 E 和 M 版本,以及 DWV 封装信息。Go
  • Added UCC5350SB to the pin configuration and function Go
  • Added Minimum Storage TemperatureGo
  • Changed Power Ratings Test ConditionsGo
  • Changed from VDE V 0884-10 to VDE V 0884-11 in insulation specification and safety-related certification tableGo
  • Changed Safety Limiting Values Go
  • Deleted test conditions for Supply CurrentsGo
  • Added Typical Curves and Test Conditions to include UCC5390 and UCC5350 informationGo
  • Changed Changed ground references, GND1 and VEE2, symbols and figure titles.Go
  • Changed On-Off Keying Diagram Go
  • Changed device functional modes tableGo
  • Deleted Device I/O Figure Go
  • Changed ESD Figure Go
  • Added 在认证部分添加 UL 在线认证目录Go

Changes from A Revision (June 2017) to B Revision

  • Changed 最低环境工作温度为 –55°C 至 –40°C Go

Changes from * Revision (June 2017) to A Revision

  • Deleted 从标题中删除了可用于未来 10A 器件的 17A 规格Go