ZHCSEL3B November   2015  – January 2016 UCC28881

PRODUCTION DATA.  

  1. 1 特性
  2. 2 应用
  3. 3 说明
  4. 4 修订历史记录
  5. 5 Device Comparison
  6. 6 Pin Configuration and Functions
  7. 7 Specifications
    1. 7.1 Absolute Maximum Ratings
    2. 7.2 ESD Ratings
    3. 7.3 Recommended Operating Conditions
    4. 7.4 Thermal Information
    5. 7.5 Electrical Characteristics
    6. 7.6 Switching Characteristics
    7. 7.7 Typical Characteristics
  8. 8 Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagram
    3. 8.3 Feature Description
    4. 8.4 Device Functional Modes
      1. 8.4.1 Start-Up Operation
      2. 8.4.2 Feedback and Voltage Control Loop
      3. 8.4.3 PWM Controller
      4. 8.4.4 Current Limit
      5. 8.4.5 Inductor Current Runaway Protection
      6. 8.4.6 Over Temperature Protection
  9. 9 Application and Implementation
    1. 9.1 Application Information
    2. 9.2 Typical Application
      1. 9.2.1 13-V, 225-mA High-Side Buck Converter
        1. 9.2.1.1 Design Requirements
        2. 9.2.1.2 Detailed Design Procedure
          1. 9.2.1.2.1 Input Stage (RF, D2, D3, C1, C2, L2)
          2. 9.2.1.2.2 Regulator Capacitor (CVDD)
          3. 9.2.1.2.3 Freewheeling Diode (D1)
          4. 9.2.1.2.4 Output Capacitor (CL)
          5. 9.2.1.2.5 Pre-Load Resistor (RL)
          6. 9.2.1.2.6 Inductor (L1)
          7. 9.2.1.2.7 Feedback Path (CFB, RFB1 and RFB2) and Load Resistor (RL)
        3. 9.2.1.3 Application Curves
      2. 9.2.2 Additional UCC28881 Application Topologies
        1. 9.2.2.1 Low-Side Buck and LED Driver - Direct Feedback (Level Shifted)
        2. 9.2.2.2 High-Side Buck Converter
        3. 9.2.2.3 Non-Isolated, Low-Side Buck-Boost Converter
        4. 9.2.2.4 Non-Isolated, High-Side Buck-Boost Converter
        5. 9.2.2.5 Non-Isolated Flyback Converter
        6. 9.2.2.6 Isolated Flyback Converter
  10. 10Power Supply Recommendations
  11. 11Layout
    1. 11.1 Layout Guidelines
    2. 11.2 Layout Example
  12. 12器件和文档支持
    1. 12.1 器件支持
      1. 12.1.1 Third-Party Products Disclaimer
    2. 12.2 社区资源
    3. 12.3 商标
    4. 12.4 静电放电警告
    5. 12.5 Glossary
  13. 13机械、封装和可订购信息

封装选项

机械数据 (封装 | 引脚)
散热焊盘机械数据 (封装 | 引脚)
订购信息

12 器件和文档支持

12.1 器件支持

12.1.1 Third-Party Products Disclaimer

TI'S PUBLICATION OF INFORMATION REGARDING THIRD-PARTY PRODUCTS OR SERVICES DOES NOT CONSTITUTE AN ENDORSEMENT REGARDING THE SUITABILITY OF SUCH PRODUCTS OR SERVICES OR A WARRANTY, REPRESENTATION OR ENDORSEMENT OF SUCH PRODUCTS OR SERVICES, EITHER ALONE OR IN COMBINATION WITH ANY TI PRODUCT OR SERVICE.

12.2 社区资源

The following links connect to TI community resources. Linked contents are provided "AS IS" by the respective contributors. They do not constitute TI specifications and do not necessarily reflect TI's views; see TI's Terms of Use.

    TI E2E™ Online Community TI's Engineer-to-Engineer (E2E) Community. Created to foster collaboration among engineers. At e2e.ti.com, you can ask questions, share knowledge, explore ideas and help solve problems with fellow engineers.
    Design Support TI's Design Support Quickly find helpful E2E forums along with design support tools and contact information for technical support.

12.3 商标

E2E is a trademark of Texas Instruments.

All other trademarks are the property of their respective owners.

12.4 静电放电警告

esds-image

这些装置包含有限的内置 ESD 保护。 存储或装卸时，应将导线一起截短或将装置放置于导电泡棉中，以防止 MOS 门极遭受静电损伤。

12.5 Glossary

SLYZ022 — TI Glossary.

This glossary lists and explains terms, acronyms, and definitions.