ZHCSKA3D September   2019  – November 2023 UCC21750-Q1

PRODUCTION DATA  

  1.   1
  2. 特性
  3. 应用
  4. 说明
  5. Revision History
  6. Pin Configuration and Functions
  7. Specifications
    1. 6.1  Absolute Maximum Ratings
    2. 6.2  ESD Ratings
    3. 6.3  Recommended Operating Conditions
    4. 6.4  Thermal Information
    5. 6.5  Power Ratings
    6. 6.6  Insulation Specifications
    7. 6.7  Safety Limiting Values
    8. 6.8  Electrical Characteristics
    9. 6.9  Safety-Related Certifications
    10. 6.10 Switching Characteristics
    11. 6.11 Insulation Characteristics Curves
    12. 6.12 Typical Characteristics
  8. Parameter Measurement Information
    1. 7.1 Propagation Delay
      1. 7.1.1 Regular Turn-OFF
    2. 7.2 Input Deglitch Filter
    3. 7.3 Active Miller Clamp
      1. 7.3.1 Internal On-Chip Active Miller Clamp
    4. 7.4 Undervoltage Lockout (UVLO)
      1. 7.4.1 VCC UVLO
      2. 7.4.2 VDD UVLO
    5. 7.5 Desaturation (DESAT) Protection
      1. 7.5.1 DESAT Protection with Soft Turn-OFF
  9. Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagram
    3. 8.3 Feature Description
      1. 8.3.1  Power Supply
      2. 8.3.2  Driver Stage
      3. 8.3.3  VCC and VDD Undervoltage Lockout (UVLO)
      4. 8.3.4  Active Pulldown
      5. 8.3.5  Short Circuit Clamping
      6. 8.3.6  Internal Active Miller Clamp
      7. 8.3.7  Desaturation (DESAT) Protection
      8. 8.3.8  Soft Turn-Off
      9. 8.3.9  Fault (FLT, Reset, and Enable (RST/EN)
      10. 8.3.10 Isolated Analog to PWM Signal Function
    4. 8.4 Device Functional Modes
  10. Applications and Implementation
    1. 9.1 Application Information
    2. 9.2 Typical Application
      1. 9.2.1 Design Requirements
      2. 9.2.2 Detailed Design Procedure
        1. 9.2.2.1 Input Filters for IN+, IN–, and RST/EN
        2. 9.2.2.2 PWM Interlock of IN+ and IN–
        3. 9.2.2.3 FLT, RDY, and RST/EN Pin Circuitry
        4. 9.2.2.4 RST/EN Pin Control
        5. 9.2.2.5 Turn-On and Turn-Off Gate Resistors
        6. 9.2.2.6 Overcurrent and Short Circuit Protection
        7. 9.2.2.7 Isolated Analog Signal Sensing
          1. 9.2.2.7.1 Isolated Temperature Sensing
          2. 9.2.2.7.2 Isolated DC Bus Voltage Sensing
        8. 9.2.2.8 Higher Output Current Using an External Current Buffer
      3. 9.2.3 Application Curves
  11. 10Power Supply Recommendations
  12. 11Layout
    1. 11.1 Layout Guidelines
    2. 11.2 Layout Example
  13. 12Device and Documentation Support
    1. 12.1 Device Support
      1. 12.1.1 第三方产品免责声明
    2. 12.2 Documentation Support
      1. 12.2.1 Related Documentation
    3. 12.3 接收文档更新通知
    4. 12.4 支持资源
    5. 12.5 Trademarks
    6. 12.6 静电放电警告
    7. 12.7 术语表
  14. 13Mechanical, Packaging, and Orderable Information

封装选项

机械数据 (封装 | 引脚)
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订购信息

Revision History

Changes from Revision C (January 2023) to Revision D (November 2023)

  • 根据最新标准将“特性”中的 ESD 等级更改为 C3Go
  • 将“特性”中的器件温度等级从 0 更改为 1Go

Changes from Revision B (March 2020) to Revision C (January 2023)

  • 向“特性”中添加了 AEC-Q100 子要点Go
  • 向“特性”中添加了安全相关认证Go
  • Added what to do with unused pins to pin functions table.Go
  • Changed recommended value of decoupling capacitors. Go
  • Added recommended decoupling capacitor layout placement. Go
  • Changed test conditions per DIN EN IEC 60747-17 (VDE 0884-17) Go
  • Changed Ichg lower limit to 430uAGo
  • Changed VAin lower limit to 0.6VGo
  • Changed direction of ICLMPI in VCLP-CLMPI test conditionGo
  • Added test condition for soft turn-off currentGo
  • Deleted short circuit clamping max conditionGo
  • Changed VDE and UL to certifiedGo
  • Changed DESAT figureGo
  • Changed DESAT soft turn-off figureGo
  • Added function state showing gate driver turning on. Changed RDY condition when VCC is PD. Go

Changes from Revision A (March 2020) to Revision B (March 2020)

  • Deleted test voltage, 9600V, from value columnGo

Changes from Revision * (September 2019) to Revision A (March 2020)

  • 将销售状态从“预告信息”更改为“量产数据”。Go