ZHCSIS9A September   2018  – December 2018 TUSB217-Q1

PRODUCTION DATA.  

  1. 1 特性
  2. 2 应用
  3. 3 说明
    1.     Device Images
      1.      简化原理图
  4. 4 修订历史记录
  5. 5 Pin Configuration and Functions
    1.     Pin Functions
  6. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
    6. 6.6 Switching Characteristics
    7. 6.7 Timing Requirements
  7. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
      1. 7.2.1 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1 High speed boost
      2. 7.3.2 RX Sensitivity
    4. 7.4 Device Functional Modes
      1. 7.4.1 Low Speed (LS) mode
      2. 7.4.2 Full Speed (FS) mode
      3. 7.4.3 High Speed (HS) mode
      4. 7.4.4 High Speed downstream port electrical compliance test mode
      5. 7.4.5 Shutdown mode
      6. 7.4.6 I2C mode
    5. 7.5 TUSB217 Registers
      1. 7.5.1 EDGE_BOOST Register (Offset = 0x1) [reset = X]
        1. Table 4. EDGE_BOOST Register Field Descriptions
      2. 7.5.2 CONFIGURATION Register (Offset = 0x3) [reset = X]
        1. Table 5. CONFIGURATION Register Field Descriptions
      3. 7.5.3 DC_BOOST Register (Offset = 0xE) [reset = X]
        1. Table 6. DC_BOOST Register Field Descriptions
      4. 7.5.4 RX_SEN Register (Offset = 0x25) [reset = X]
        1. Table 7. RX_SEN Register Field Descriptions
  8. 8 Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Application
      1. 8.2.1 Design Requirements
      2. 8.2.2 Detailed Design Procedure
        1. 8.2.2.1 Test Procedure to Construct USB High Speed Eye Diagram
          1. 8.2.2.1.1 For a Host Side Application
          2. 8.2.2.1.2 For a Device Side Application
      3. 8.2.3 Application Curves
  9. 9 Power Supply Recommendations
  10. 10Layout
    1. 10.1 Layout Guidelines
    2. 10.2 Layout Example
  11. 11器件和文档支持
    1. 11.1 文档支持
    2. 11.2 接收文档更新通知
    3. 11.3 社区资源
    4. 11.4 商标
    5. 11.5 静电放电警告
    6. 11.6 术语表
  12. 12机械、封装和可订购信息

封装选项

请参考 PDF 数据表获取器件具体的封装图。

机械数据 (封装 | 引脚)
  • RGY|14
散热焊盘机械数据 (封装 | 引脚)
订购信息

9 Power Supply Recommendations

On power up, the interaction of the RSTN pin and power on ramp could result in digital circuits not being set correctly. The device should not be enabled until the power on ramp has settled to minimum recommended supply voltage or higher to ensure a correct power on reset of the digital circuitry. If RSTN cannot be held low by microcontroller or other circuitry until the power on ramp has settled, then an external capacitor from the RSTN pin to GND is required to hold the device in the low power reset state.

The RC time constant should be larger than five times of the power on ramp time (0 to VCC). With a typical internal pullup resistance of 500 kΩ, the recommended minimum external capacitance is calculated as:

Equation 1. [Ramp Time x 5] ÷ [500 kΩ]