ZHCSIS9A September   2018  – December 2018 TUSB217-Q1

PRODUCTION DATA.  

  1. 特性
  2. 应用
  3. 说明
    1.     Device Images
      1.      简化原理图
  4. 修订历史记录
  5. Pin Configuration and Functions
    1.     Pin Functions
  6. Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
    6. 6.6 Switching Characteristics
    7. 6.7 Timing Requirements
  7. Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
      1. 7.2.1 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1 High speed boost
      2. 7.3.2 RX Sensitivity
    4. 7.4 Device Functional Modes
      1. 7.4.1 Low Speed (LS) mode
      2. 7.4.2 Full Speed (FS) mode
      3. 7.4.3 High Speed (HS) mode
      4. 7.4.4 High Speed downstream port electrical compliance test mode
      5. 7.4.5 Shutdown mode
      6. 7.4.6 I2C mode
    5. 7.5 TUSB217 Registers
      1. 7.5.1 EDGE_BOOST Register (Offset = 0x1) [reset = X]
        1. Table 4. EDGE_BOOST Register Field Descriptions
      2. 7.5.2 CONFIGURATION Register (Offset = 0x3) [reset = X]
        1. Table 5. CONFIGURATION Register Field Descriptions
      3. 7.5.3 DC_BOOST Register (Offset = 0xE) [reset = X]
        1. Table 6. DC_BOOST Register Field Descriptions
      4. 7.5.4 RX_SEN Register (Offset = 0x25) [reset = X]
        1. Table 7. RX_SEN Register Field Descriptions
  8. Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Application
      1. 8.2.1 Design Requirements
      2. 8.2.2 Detailed Design Procedure
        1. 8.2.2.1 Test Procedure to Construct USB High Speed Eye Diagram
          1. 8.2.2.1.1 For a Host Side Application
          2. 8.2.2.1.2 For a Device Side Application
      3. 8.2.3 Application Curves
  9. Power Supply Recommendations
  10. 10Layout
    1. 10.1 Layout Guidelines
    2. 10.2 Layout Example
  11. 11器件和文档支持
    1. 11.1 文档支持
    2. 11.2 接收文档更新通知
    3. 11.3 社区资源
    4. 11.4 商标
    5. 11.5 静电放电警告
    6. 11.6 术语表
  12. 12机械、封装和可订购信息

封装选项

请参考 PDF 数据表获取器件具体的封装图。

机械数据 (封装 | 引脚)
  • RGY|14
散热焊盘机械数据 (封装 | 引脚)
订购信息

Detailed Design Procedure

The ideal BOOST setting is dependent upon the signal chain loss characteristics of the target platform. The recommendation is to start with BOOST level 0, and then increment to BOOST level 1, and so on. if permissible. Same applies to the RX sensitivity setting where it is recommended to plan for the required pads or connections to change boost settings, but to start with RX sensitivity level 1.

In order for the TUSB217-Q1 to recognize any change to the BOOST setting, the RSTN pin must be toggled. This is because the BOOST pin is latched on power up and the pin is ignored thereafter.

NOTE

The TUSB217-Q1 compensates for extra attenuation in the signal path according to the configuration of the RX_SEN pin. This pin is not 5 V tolerant and therefore when selecting the highest RX sensitivity level, the voltage level at RX_SEN pin must be less than 3.6V.

Placement of the device is also dependent on the application goal. Table 11 summarizes our recommendations.

Table 11. Platform Placement Guideline

PLATFORM GOAL SUGGESTED TUSB217-Q1 PLACEMENT
Pass USB Near End Mask at the receptacle Close to measurement point (connector)
Pass USB Far End Eye Mask at the plug Close to USB PHY
Cascade multiple TUSB217s to improve device enumeration Midway between each USB interconnect

Table 12. Table of Recommended Settings

BOOST and RX_SEN settings (1)for channel loss
Pre-channel cable length (Between USB PHY and TUSB217-Q1) BOOST RX_SEN
0-3 meter Level 0 Medium or High
2-5 meter Level 1 Medium or High
Post-channel cable length (Between TUSB217-Q1 and inter-connect) BOOST RX_SEN
0-2 meter Level 0 Medium or High
1-4 meter Level 1 Medium or High
These parameters are starting values for different cable lengths. Further tuning might be required based on specific host and/or device as well as cable length and loss profile.