ZHCSAQ2B
January 2013 – April 2017
TS3A5223
PRODUCTION DATA.
1
特性
2
应用
3
说明
4
修订历史记录
5
Pin Configuration and Functions
6
Specifications
6.1
Absolute Maximum Ratings
6.2
ESD Ratings
6.3
Recommended Operating Conditions
6.4
Thermal Information
6.5
Electrical Characteristics
6.6
Typical Characteristics
7
Parameter Measurement Information
8
Detailed Description
8.1
Overview
8.2
Functional Block Diagram
8.3
Feature Description
8.3.1
Digital Logic Translation
8.3.2
Break-Before-Make
8.4
Device Functional Modes
9
Application and Implementation
9.1
Application Information
9.2
Typical Application
9.2.1
Design Requirements
9.2.2
Detailed Design Procedure
9.2.3
Application Curves
10
Power Supply Recommendations
11
Layout
11.1
Layout Guidelines
11.2
Layout Example
12
器件和文档支持
12.1
文档支持
12.2
接收文档更新通知
12.3
社区资源
12.4
商标
12.5
静电放电警告
12.6
Glossary
13
机械、封装和可订购信息
封装选项
机械数据 (封装 | 引脚)
RSW|10
MPQF206C
散热焊盘机械数据 (封装 | 引脚)
订购信息
zhcsaq2b_oa
zhcsaq2b_pm
11
Layout
11.1
Layout Guidelines
TI recommends following common printed-circuit board layout guidelines to ensure reliability of the device.
Bypass capacitors should be used on power supplies.
Short trace lengths should be used to avoid excessive loading.
11.2
Layout Example
Figure 15.
Layout Example