ZHCSR60B August   2007  – October 2022 TRSF3243

PRODUCTION DATA  

  1. 1特性
  2. 2应用
  3. 3说明
  4. 4Revision History
  5. 5Pin Configuration and Functions
  6. 6Specifications
    1. 6.1  Absolute Maximum Ratings
    2. 6.2  Recommended Operating Conditions
    3. 6.3  Thermal Information
    4. 6.4  Electrical Characteristics
    5. 6.5  Electrical Characteristics: Driver
    6. 6.6  Switching Characteristics: Driver
    7. 6.7  Electrical Characteristics: Receiver
    8. 6.8  Switching Characteristics: Receiver
    9. 6.9  Electrical Characteristics: Auto-Powerdown
    10. 6.10 Switching Characteristics: Auto-Powerdown
      1.      Parameter Measurement Information
  7. 7Detailed Description
    1. 7.1 Overview
    2. 7.2 Device Functional Modes
      1. 7.2.1 Function Tables
  8. 8Device and Documentation Support
    1. 8.1 接收文档更新通知
    2. 8.2 支持资源
    3. 8.3 商标
    4. 8.4 Electrostatic Discharge Caution
    5. 8.5 术语表
  9. 9Mechanical, Packaging, and Orderable Information

封装选项

机械数据 (封装 | 引脚)
散热焊盘机械数据 (封装 | 引脚)
订购信息

Electrical Characteristics

over recommended ranges of supply voltage and operating free-air temperature (unless otherwise noted) (see Figure 7-6) (2)
PARAMETER TEST CONDITIONS MIN TYP(1) MAX UNIT
II Input leakage current FORCEOFF, FORCEON ±0.01 ±1 μA
ICC Supply current Auto-powerdown disabled No load,
FORCEOFF and FORCEON = VCC
For DB and PW package
0.3 1.2 mA
Auto-powerdown disabled No load,
FORCEOFF and FORCEON = VCC
For DW package
0.3 1 mA
Powered off No load, FORCEOFF = GND 1 10 μA
Auto-powerdown enabled No load, FORCEOFF = VCC,
FORCEON = GND,
All RIN are open or grounded,
All DIN are grounded
1 10
All typical values are at VCC = 3.3 V or VCC = 5 V, and TA = 25°C.
Test conditions are C1–C4 = 0.1 μF at VCC = 3.3 V ± 0.3 V; C1 = 0.047 μF, C2–C4 = 0.33 μF at VCC = 5 V ± 0.5 V.