ZHCSU22 数据表 | 德州仪器 TI.com.cn

ZHCSU22B August 2007 – December 2023 TRSF3223E

PRODUCTION DATA

4.5 Thermal Information

THERMAL METRIC⁽¹⁾		DB (SOIC)	DW (SOIC)	PW (TSSOP)	RGW (VQFN)	UNIT
THERMAL METRIC⁽¹⁾		20 PINS	20 PINS	20 PINS	20 PINS	UNIT
R_θJA	Junction-to-ambient thermal resistance	76.2	76.8	89.7	32.2	°C/W
R_θJC(top)	Junction-to-case (top) thermal resistance	36.8	39.6	29.0	23.7	°C/W
^R_θJB	Junction-to-board thermal resistance	33.9	41.5	41.9	11.5	°C/W
ψ_JT	Junction-to-top characterization parameter	6.7	12.6	1.9	0.3	°C/W
ψ_JB	Junction-to-board characterization parameter	33.6	40.9	41.3	11.5	°C/W
R_θJC(bot)	Junction-to-case (bottom) thermal resistance	n/a	n/a	n/a	2.6	°C/W

(1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application report.