ZHCS762F December   2011  – May 2017 TRF7963A

PRODUCTION DATA.  

  1. 1器件概述
    1. 1.1 特性
    2. 1.2 应用
    3. 1.3 说明
    4. 1.4 应用框图
  2. 2修订历史记录
  3. 3Device Characteristics
    1. 3.1 Related Products
  4. 4Terminal Configuration and Functions
    1. 4.1 Pin Diagrams
    2. 4.2 Signal Descriptions
  5. 5Specifications
    1. 5.1 Absolute Maximum Ratings
    2. 5.2 ESD Ratings
    3. 5.3 Recommended Operating Conditions
    4. 5.4 Electrical Characteristics
    5. 5.5 Thermal Resistance Characteristics
    6. 5.6 Switching Characteristics
  6. 6Detailed Description
    1. 6.1  Functional Block Diagram
    2. 6.2  Power Supplies
    3. 6.3  Supply Arrangements
    4. 6.4  Supply Regulator Settings
    5. 6.5  Power Modes
    6. 6.6  Receiver – Analog Section
      1. 6.6.1 Main and Auxiliary Receiver
      2. 6.6.2 Receiver Gain and Filter Stages
    7. 6.7  Receiver – Digital Section
      1. 6.7.1 Received Signal Strength Indicator (RSSI)
        1. 6.7.1.1 Internal RSSI – Main and Auxiliary Receivers
        2. 6.7.1.2 External RSSI
    8. 6.8  Oscillator Section
    9. 6.9  Transmitter - Analog Section
    10. 6.10 Transmitter - Digital Section
    11. 6.11 Transmitter – External Power Amplifier or Subcarrier Detector
    12. 6.12 Communication Interface
      1. 6.12.1 General Introduction
      2. 6.12.2 FIFO Operation
      3. 6.12.3 Parallel Interface Mode
      4. 6.12.4 Reception of Air Interface Data
      5. 6.12.5 Data Transmission to MCU
      6. 6.12.6 Serial Interface Communication (SPI)
        1. 6.12.6.1 Serial Interface Mode Without Slave Select (SS)
        2. 6.12.6.2 Serial Interface Mode With Slave Select (SS)
      7. 6.12.7 Direct Mode
    13. 6.13 Direct Commands from MCU to Reader
      1. 6.13.1 Command Codes
      2. 6.13.2 Reset FIFO (0x0F)
      3. 6.13.3 Transmission With CRC (0x11)
      4. 6.13.4 Transmission Without CRC (0x10)
      5. 6.13.5 Block Receiver (0x16)
      6. 6.13.6 Enable Receiver (0x17)
      7. 6.13.7 Test Internal RF (RSSI at RX Input With TX On) (0x18)
      8. 6.13.8 Test External RF (RSSI at RX Input With TX Off) (0x19)
      9. 6.13.9 Register Preset
    14. 6.14 Register Description
      1. 6.14.1 Register Overview
        1. 6.14.1.1 Main Configuration Registers
          1. 6.14.1.1.1 Chip Status Control Register (0x00)
          2. 6.14.1.1.2 ISO Control Register (0x01)
        2. 6.14.1.2 Protocol Subsetting Registers
          1. 6.14.1.2.1 ISO14443B TX Options Register (0x02)
          2. 6.14.1.2.2 ISO14443A High-Bit-Rate and Parity Options Register (0x03)
          3. 6.14.1.2.3 TX Pulse Length Control Register (0x06)
          4. 6.14.1.2.4 RX No Response Wait Time Register (0x07)
          5. 6.14.1.2.5 RX Wait Time Register (0x08)
          6. 6.14.1.2.6 Modulator and SYS_CLK Control Register (0x09)
          7. 6.14.1.2.7 RX Special Setting Register (0x0A)
          8. 6.14.1.2.8 Regulator and I/O Control Register (0x0B)
        3. 6.14.1.3 Status Registers
          1. 6.14.1.3.1 IRQ Status Register (0x0C)
          2. 6.14.1.3.2 Collision Position and Interrupt Mask Registers (0x0D and 0x0E)
          3. 6.14.1.3.3 RSSI Levels and Oscillator Status Register (0x0F)
        4. 6.14.1.4 Test Registers
          1. 6.14.1.4.1 Test Register (0x1A)
          2. 6.14.1.4.2 Test Register (0x1B)
        5. 6.14.1.5 FIFO Control Registers
          1. 6.14.1.5.1 FIFO Status Register (0x1C)
          2. 6.14.1.5.2 TX Length Byte1 Register (0x1D) and TX Length Byte2 Register (0x1E)
  7. 7Applications, Implementation, and Layout
    1. 7.1 TRF7963A Reader System Using SPI With SS Mode
      1. 7.1.1 General Application Considerations
      2. 7.1.2 Schematic
    2. 7.2 System Design
      1. 7.2.1 Layout Considerations
      2. 7.2.2 Impedance Matching TX_Out (Pin 5) to 50 Ω
      3. 7.2.3 Reader Antenna Design Guidelines
  8. 8器件和文档支持
    1. 8.1 入门和后续步骤
    2. 8.2 器件命名规则
    3. 8.3 工具和软件
    4. 8.4 文档支持
    5. 8.5 社区资源
    6. 8.6 商标
    7. 8.7 静电放电警告
    8. 8.8 出口管制提示
    9. 8.9 Glossary
  9. 9机械、封装和可订购信息

封装选项

机械数据 (封装 | 引脚)
散热焊盘机械数据 (封装 | 引脚)
订购信息

6.8 Oscillator Section

The 13.56-MHz oscillator is controlled by the Chip Status Control register (0x00) and the EN and EN2 signals. The oscillator generates the RF frequency for the RF output stage and the clock source for the digital section. The buffered clock signal is available at pin 27 (SYS_CLK) for external circuits. B4 and B5 inside the Modulation and SYS_CLK register (0x09) can be used to divide the external SYS_CLK signal at pin 27 by 1, 2, or 4.

Typical start-up time from complete power down is in the range of 3.5 ms.

During Power Down Mode 2 (EN = 0, EN2 = 1) the frequency of SYS_CLK is switched to 60 kHz (typical).

The 13.56-MHz crystal must be connected between pin 30 and pin 31. The external shunt capacitors values for C1 and C2 must be calculated based on the specified load capacitance of the crystal being used. The external shunt capacitors are calculated as two identical capacitors in series plus the stray capacitance of the TRF7963A and parasitic PCB capacitance in parallel to the crystal.

The parasitic capacitance (CS , stray and parasitic PCB capacitance) can be estimated at 4 to 5 pF (typical).

As an example, using a crystal with a required load capacitance (CL) of 18 pF, the calculation is as follows (see Figure 6-4):

C1= C2 = 2 × (CL – CS) = 2 × (18 pF – 4.5 pF) = 27 pF

Place a 27-pF capacitor on pins 30 and 31 to ensure proper crystal oscillator operation.

TRF7963A crystal_bd_slos732.gifFigure 6-4 Crystal Block Diagram

Table 6-5 shows the minimum characteristics recommended for any crystal used with TRF7963A.

Table 6-5 Minimum Crystal Recommendations

PARAMETERSPECIFICATION
Frequency 13.56 MHz
Mode of operation Fundamental
Type of resonance Parallel
Frequency tolerance ±20 ppm
Aging <5 ppm/year
Operation temperature range –40°C to 85°C

As an alternative, an external clock oscillator source can be connected to pin 31 to provide the system clock, and pin 30 can be left open.