ZHCSMK6B September   2021  – November 2022 TPSM82864A , TPSM82866A

PRODUCTION DATA  

  1. 1 特性
  2. 2 应用
  3. 3 说明
  4. 4 Revision History
  5. 5 Device Options
  6. 6 Pin Configuration and Functions
  7. 7 Specifications
    1. 7.1 Absolute Maximum Ratings
    2. 7.2 ESD Ratings
    3. 7.3 Recommended Operating Conditions
    4. 7.4 Thermal Information
    5. 7.5 Electrical Characteristics
    6. 7.6 Typical Characteristics
  8. 8 Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagram
    3. 8.3 Feature Description
      1. 8.3.1 Power Save Mode
      2. 8.3.2 Forced PWM Mode
      3. 8.3.3 Optimized Transient Performance from PWM to PSM Operation
      4. 8.3.4 Low Dropout Operation (100% Duty Cycle)
      5. 8.3.5 Soft Start
      6. 8.3.6 Switch Current Limit and HICCUP Short-Circuit Protection
      7. 8.3.7 Undervoltage Lockout
      8. 8.3.8 Thermal Shutdown
    4. 8.4 Device Functional Modes
      1. 8.4.1 Enable and Disable (EN)
      2. 8.4.2 Output Discharge
      3. 8.4.3 Power Good (PG)
      4. 8.4.4 Output Voltage and Mode Selection (VSET/MODE)
  9. 9 Application and Implementation
    1. 9.1 Application Information
    2. 9.2 Typical Application
      1. 9.2.1 Design Requirements
      2. 9.2.2 Detailed Design Procedure
        1. 9.2.2.1 Setting The Output Voltage
        2. 9.2.2.2 Input and Output Capacitor Selection
      3. 9.2.3 Application Curves
    3. 9.3 Power Supply Recommendations
    4. 9.4 Layout
      1. 9.4.1 Layout Guidelines
      2. 9.4.2 Layout Example
        1. 9.4.2.1 Thermal Considerations
  10. 10Device and Documentation Support
    1. 10.1 Device Support
      1. 10.1.1 第三方产品免责声明
    2. 10.2 Documentation Support
      1. 10.2.1 Related Documentation
    3. 10.3 接收文档更新通知
    4. 10.4 支持资源
    5. 10.5 Trademarks
    6. 10.6 Electrostatic Discharge Caution
    7. 10.7 术语表
  11. 11Mechanical, Packaging, and Orderable Information

封装选项

机械数据 (封装 | 引脚)
散热焊盘机械数据 (封装 | 引脚)
订购信息

9.4.2.1 Thermal Considerations

The TPSM8286xA power module temperature must be kept less than the maximum rating of 125°C. The following are three basic approaches for enhancing thermal performance:

  • Improve the power dissipation capability of the PCB design.
  • Improve the thermal coupling of the component to the PCB.
  • Introduce airflow into the system.

To estimate the approximate module temperature of the TPSM8286xA, apply the typical efficiency stated in this data sheet to the desired application condition to compute the power dissipation of the module. Then, calculate the module temperature rise by multiplying the power dissipation by its thermal resistance. Using this method to compute the maximum device temperature, the Safe Operating Area (SOA) graphs demonstrate the required derating in maximum output current at high ambient temperatures. For more details on how to use the thermal parameters in real applications, see the Thermal Characteristics of Linear and Logic Packages Using JEDEC PCB Designs Application Report and Semiconductor and IC Package Thermal Metrics Application Report.