THERMAL METRIC(1) |
TPSM5D1806 |
UNIT |
RDB (QFN) |
51 PINS |
RθJA |
Junction-to-ambient thermal resistance (2) |
13.9 |
°C/W |
ΨJT |
Junction-to-top characterization parameter (3) |
1.8 |
°C/W |
ΨJB |
Junction-to-board characterization parameter (4) |
9.4 |
°C/W |
TSHDN |
Thermal Shutdown Temperature |
165 |
°C |
TSHDN |
Thermal Shutdown Hysteresis |
20 |
°C |
(2) The junction-to-ambient thermal resistance, RθJA, applies to devices soldered directly to a 100 mm × 100 mm, 6-layer PCB with 2 oz. copper and natural convection cooling. Additional airflow reduces RθJA.
(3) The junction-to-top characterization parameter, ψJT, estimates the junction temperature, TJ, of a device in a real system, using a procedure described in JESD51-2A (section 6 and 7). TJ = ψJT × Pdis + TT; where Pdis is the power dissipated in the device and TT is the temperature of the top of the device.
(4) The junction-to-board characterization parameter, ψJB,
estimates the junction temperature, TJ, of a device in a real system, using a
procedure described in JESD51-2A (sections 6 and 7). TJ = ψJB × Pdis +
TB; where Pdis is the power dissipated in the device and TB is the
temperature of the board 1 mm from the device.