SBVS449 June   2026 TPS7B7802-Q1

ADVANCE INFORMATION  

  1.   1
  2. Features
  3. Applications
  4. Description
  5. Pin Configuration and Functions
  6. Specifications
    1. 5.1 Absolute Maximum Ratings
    2. 5.2 ESD Ratings
    3. 5.3 Recommended Operating Conditions
    4. 5.4 Thermal Information
    5. 5.5 Electrical Characteristics
    6. 5.6 Timing Requirements - I2C Standard Mode
    7. 5.7 Timing Requirements - I2C Fast Mode
    8. 5.8 Timing Requirements - I2C Fast Mode Plus
    9. 5.9 Switching Characteristics
  7. Detailed Description
    1. 6.1 Overview
    2. 6.2 Functional Block Diagram
    3. 6.3 Feature Description
      1. 6.3.1  Input Under-Voltage Lockout (UVLO)
      2. 6.3.2  Enable
      3. 6.3.3  Output Voltage Setting
      4. 6.3.4  Soft Start
      5. 6.3.5  Voltage Monitoring
      6. 6.3.6  Current Monitoring
      7. 6.3.7  Reverse Current Protection
      8. 6.3.8  Current Limit
      9. 6.3.9  Junction Temperature Monitoring
      10. 6.3.10 Thermal Protection
      11. 6.3.11 Protection Features and Diagnostic Capabilities
      12. 6.3.12 NERR Pin
      13. 6.3.13 Blanking Time
      14. 6.3.14 Switch Mode
    4. 6.4 Device Functional Modes
      1. 6.4.1 Normal Operation
      2. 6.4.2 Dropout
      3. 6.4.3 Operation with VIN < 4.5V
      4. 6.4.4 Disable
    5. 6.5 Programming
      1. 6.5.1 I2C Interface
        1. 6.5.1.1 I2C Interface Speed
      2. 6.5.2 I2C Data Transfer Protocol
        1. 6.5.2.1 START and STOP
        2. 6.5.2.2 Logical 1's and 0's
        3. 6.5.2.3 Data Format
      3. 6.5.3 Address Frame
      4. 6.5.4 Write Cycle
      5. 6.5.5 Read Cycle
  8. Register Map
    1. 7.1 Default Settings
    2. 7.2 Register Details
  9. Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Application
      1. 8.2.1 Design Requirements
      2. 8.2.2 Detailed Design Procedure
        1. 8.2.2.1 Input and Output Capacitor Selection
        2. 8.2.2.2 Adjustable Device Feedback Resistor Selection
        3. 8.2.2.3 Feed-Forward Capacitor
        4. 8.2.2.4 Power Dissipation (PD)
        5. 8.2.2.5 Estimating Junction Temperature
    3. 8.3 Power Supply Recommendations
    4. 8.4 Layout
      1. 8.4.1 Layout Guidelines
      2. 8.4.2 Layout Example
  10. Device and Documentation Support
    1. 9.1 Device Support
      1. 9.1.1 Device Nomenclature
    2. 9.2 Receiving Notification of Documentation Updates
    3. 9.3 Support Resources
    4. 9.4 Trademarks
    5. 9.5 Electrostatic Discharge Caution
    6. 9.6 Glossary
  11. 10Revision History
  12. 11Mechanical, Packaging, and Orderable Information
    1. 11.1 Mechanical Data

封装选项

机械数据 (封装 | 引脚)
散热焊盘机械数据 (封装 | 引脚)

Design Requirements

For this design example, use the parameters listed in Table 8-1 as the input parameters.

Table 8-1 Design Parameters
PARAMETERVALUE
Input voltage range4.5 to 40V
Output voltage2 to (VIN - VDO)
Output capacitor range4.7 - 100μF
Output Capacitor ESR range 0.001 - 0.5Ω
Programmable current limit (typ, using I2C) 25 - 350mA