ZHCSEP4A January   2016  – February 2016 TPS7A85

PRODUCTION DATA.  

  1. 1 特性
  2. 2 应用
  3. 3 说明
  4. 4 修订历史记录
  5. 5 Pin Configurations and Functions
  6. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
    6. 6.6 Typical Characteristics
  7. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1  Low-Noise, High-PSRR Output
      2. 7.3.2  Integrated Resistance Network (ANY-OUT)
      3. 7.3.3  Bias Rail
      4. 7.3.4  Power-Good (PG) Function
      5. 7.3.5  Programmable Soft-Start
      6. 7.3.6  Internal Current Limit (ILIM)
      7. 7.3.7  Enable
      8. 7.3.8  Active Discharge Circuit
      9. 7.3.9  Undervoltage Lockout (UVLO)
      10. 7.3.10 Thermal Protection
    4. 7.4 Device Functional Modes
      1. 7.4.1 Operation with 1.1 V ≤ VIN < 1.4 V
      2. 7.4.2 Operation with 1.4 V ≤ VIN ≤ 6.5 V
      3. 7.4.3 Shutdown
  8. 8 Application and Implementation
    1. 8.1 Application Information
      1. 8.1.1  Recommended Capacitor Types
      2. 8.1.2  Input and Output Capacitor Requirements (CIN and COUT)
      3. 8.1.3  Noise-Reduction and Soft-Start Capacitor (CNR/SS)
      4. 8.1.4  Feed-Forward Capacitor (CFF)
      5. 8.1.5  Soft-Start and In-Rush Current
      6. 8.1.6  Optimizing Noise and PSRR
        1. 8.1.6.1 Charge Pump Noise
      7. 8.1.7  ANY-OUT Programmable Output Voltage
      8. 8.1.8  ANY-OUT Operation
      9. 8.1.9  Increasing ANY-OUT Resolution for LILO Conditions
      10. 8.1.10 Current Sharing
      11. 8.1.11 Adjustable Operation
      12. 8.1.12 Sequencing Requirements
        1. 8.1.12.1 Sequencing with a Power-Good DC-DC Converter Pin
        2. 8.1.12.2 Sequencing with a Microcontroller (MCU)
      13. 8.1.13 Power-Good (PG) Operation
      14. 8.1.14 Undervoltage Lockout (UVLO) Operation
      15. 8.1.15 Dropout Voltage (VDO)
      16. 8.1.16 Behavior when Transitioning from Dropout into Regulation
      17. 8.1.17 Load Transient Response
      18. 8.1.18 Negatively-Biased Output
      19. 8.1.19 Reverse Current Protection
      20. 8.1.20 Power Dissipation (PD)
        1. 8.1.20.1 Estimating Junction Temperature
        2. 8.1.20.2 Recommended Area for Continuous Operation (RACO)
    2. 8.2 Typical Applications
      1. 8.2.1 Low-Input, Low-Output (LILO) Voltage Conditions
        1. 8.2.1.1 Design Requirements
        2. 8.2.1.2 Detailed Design Procedure
        3. 8.2.1.3 Application Curves
      2. 8.2.2 Typical Application for a 5.0-V Rail
        1. 8.2.2.1 Design Requirements
        2. 8.2.2.2 Detailed Design Procedure
        3. 8.2.2.3 Application Curves
  9. 9 Power-Supply Recommendations
  10. 10Layout
    1. 10.1 Layout Guidelines
      1. 10.1.1 Board Layout
    2. 10.2 Layout Example
  11. 11器件和文档支持
    1. 11.1 器件支持
      1. 11.1.1 开发支持
        1. 11.1.1.1 评估模块
        2. 11.1.1.2 Spice 模型
      2. 11.1.2 器件命名规则
    2. 11.2 文档支持
      1. 11.2.1 相关文档　
    3. 11.3 社区资源
    4. 11.4 商标
    5. 11.5 静电放电警告
    6. 11.6 Glossary
  12. 12机械、封装和可订购信息

封装选项

机械数据 (封装 | 引脚)
散热焊盘机械数据 (封装 | 引脚)
订购信息

11 器件和文档支持

11.1 器件支持

11.1.1 开发支持

11.1.1.1 评估模块

评估模块 (EVM) 可与 TPS7A85 配套使用，帮助评估初始电路性能。有关此固定装置的相关摘要信息，请参见Table 8。

Table 8. 设计套件与评估模块

名称 文献编号
TPS7A8300EVM-209 评估模块 SLVU919
TPS7A8300EVM-579 评估模块 SBVU021

您可以在德州仪器 (TI) 网站上的 TPS7A85 产品文件夹中获取 EVM。

11.1.1.2 Spice 模型

分析模拟电路和系统的性能时，使用 SPICE 模型对电路性能进行计算机仿真非常有用。您可以从 TPS7A85 产品文件夹中的仿真模型下获取 TPS7A85 的 SPICE 模型。

11.1.2 器件命名规则

Table 9. 订购信息(1)

产品 说明
TPS7A85YYZ YY 为封装标识符。
Z 为封装数量。
(1) 欲获得最新的封装和订货信息，请参阅本文档末尾的封装选项附录，或者访问 www.ti.com 查看器件产品文件夹。

11.2 文档支持

11.2.1 相关文档　

相关文档如下：

  • TPS3702 数据表，SBVS251
  • TPS7A8300EVM-209 评估模块，SLVU919
  • TPS7A8300EVM-579 评估模块，SBVU021
  • TI LDO 应用手册的主题索引，SBVA026
  • 使用前馈电容器和低压降稳压器的优缺点， SBVA042
  • 6A 电流均流双路 LDO，TIDU421

11.3 社区资源

The following links connect to TI community resources. Linked contents are provided "AS IS" by the respective contributors. They do not constitute TI specifications and do not necessarily reflect TI's views; see TI's Terms of Use.

    TI E2E™ Online Community TI's Engineer-to-Engineer (E2E) Community. Created to foster collaboration among engineers. At e2e.ti.com, you can ask questions, share knowledge, explore ideas and help solve problems with fellow engineers.
    Design Support TI's Design Support Quickly find helpful E2E forums along with design support tools and contact information for technical support.

11.4 商标

ANY-OUT, E2E are trademarks of Texas Instruments.

All other trademarks are the property of their respective owners.

11.5 静电放电警告

esds-image

ESD 可能会损坏该集成电路。德州仪器 (TI) 建议通过适当的预防措施处理所有集成电路。如果不遵守正确的处理措施和安装程序 , 可能会损坏集成电路。

ESD 的损坏小至导致微小的性能降级 , 大至整个器件故障。 精密的集成电路可能更容易受到损坏 , 这是因为非常细微的参数更改都可能会导致器件与其发布的规格不相符。

11.6 Glossary

SLYZ022 — TI Glossary.

This glossary lists and explains terms, acronyms, and definitions.