ZHCSSO4D September   2010  – December 2023 TPS74801-Q1

PRODUCTION DATA  

  1.   1
  2. 1 特性
  3. 2 应用
  4. 3 说明
  5. 4 Pin Configuration and Functions
  6. 5 Specifications
    1. 5.1 Absolute Maximum Ratings
    2. 5.2 ESD Ratings
    3. 5.3 Recommended Operating Conditions
    4. 5.4 Thermal Information
    5. 5.5 Electrical Characteristics
    6. 5.6 Typical Characteristics: IOUT = 50 mA
    7. 5.7 Typical Characteristics: IOUT = 1 A
  7. 6 Detailed Description
    1. 6.1 Overview
    2. 6.2 Functional Block Diagram
    3. 6.3 Feature Description
      1. 6.3.1 Programmable Soft-Start
      2. 6.3.2 Sequencing Requirements
      3. 6.3.3 Output Noise
      4. 6.3.4 Enable and Shutdown
      5. 6.3.5 Power Good
      6. 6.3.6 Internal Current Limit
      7. 6.3.7 Thermal Protection
    4. 6.4 Device Functional Modes
      1. 6.4.1 Normal Operation
      2. 6.4.2 Dropout Operation
      3. 6.4.3 Disabled
  8. 7 Application and Implementation
    1. 7.1 Application Information
    2. 7.2 Typical Application
      1. 7.2.1 Design Requirements
      2. 7.2.2 Detailed Design Procedure
        1. 7.2.2.1 Input, Output, and Bias Capacitor Requirements
        2. 7.2.2.2 Transient Response
      3. 7.2.3 Application Curves
    3. 7.3 Power Supply Recommendations
    4. 7.4 Layout
      1. 7.4.1 Layout Guidelines
        1. 7.4.1.1 Layout Recommendations and Power Dissipation
        2. 7.4.1.2 Estimating Junction Temperature
      2. 7.4.2 Layout Example
  9. 8 Device and Documentation Support
    1. 8.1 Documentation Support
      1. 8.1.1 Related Documentation
      2. 8.1.2 Device Nomenclature
    2. 8.2 接收文档更新通知
    3. 8.3 支持资源
    4. 8.4 Trademarks
    5. 8.5 静电放电警告
    6. 8.6 术语表
  10. 9 Revision History
  11. 10Mechanical, Packaging, and Orderable Information

封装选项

机械数据 (封装 | 引脚)
散热焊盘机械数据 (封装 | 引脚)
订购信息

9 Revision History

Changes from Revision C (July 2023) to Revision D (December 2023)

  • 通篇添加了器件措辞以区分旧芯片和新芯片信息Go
  • 更改了说明 部分：更改了导通响应 图并为新芯片添加了温度范围Go
  • Changed Typical Characteristics sections to show legacy chip and new chip data side by side and deleted VIN Dropout Voltage vs VBIAS-VOUT curvesGo
  • Changed images in Estimating Junction Temperature sectionGo
  • Deleted RGW Example figure from Layout Example sectionGo
  • Added Device Nomenclature sectionGo

Changes from Revision B (July 2013) to Revision C (July 2023)

  • 添加了器件信息 表、引脚配置和功能 部分、ESD 等级 表、特性说明 部分、器件功能模式、应用和实施 部分、器件和文档支持 部分以及机械、封装和可订购信息 部分Go
  • 向文档添加了 M3 器件Go
  • 更改了特定于汽车的特性 要点Go
  • 通篇将 QFN 更改为 VQFNGo
  • 添加了指向应用 部分的链接Go
  • 删除了说明 部分中对 TPS74401 的引用Go
  • Added Design Requirements sectionGo
  • Changed footnote 1 on Standard Capacitor Values for Programming the Soft-Start Time tableGo
  • Added Application Curves sectionGo