ZHCSAL3T
December 2005 – April 2025
TPS74401
PRODUCTION DATA
1
1
特性
2
应用
3
说明
4
Pin Configuration and Functions
5
Specifications
5.1
Absolute Maximum Ratings
5.2
ESD Ratings
5.3
Recommended Operating Conditions
5.4
Thermal Information
5.5
Electrical Characteristics
5.6
Typical Characteristics
6
Detailed Description
6.1
Overview
6.2
Functional Block Diagrams
6.3
Feature Description
6.3.1
Enable, Shutdown
6.3.2
Power-Good (VQFN Package Only)
6.3.3
Internal Current Limit
6.3.4
Thermal Protection
6.4
Device Functional Modes
6.4.1
Normal Operation
6.4.2
Dropout Operation
6.4.3
Disabled
6.5
Programming
6.5.1
Programmable Soft-Start
6.5.2
Sequencing Requirements
7
Application and Implementation
7.1
Application Information
7.1.1
Input, Output, and Bias Capacitor Requirements
7.1.2
Transient Response
7.1.3
Dropout Voltage
7.1.4
Output Noise
7.2
Typical Applications
7.2.1
Setting the TPS74401
7.2.1.1
Design Requirements
7.2.1.2
Detailed Design Procedure
7.2.1.3
Application Curves
7.2.2
Using an Auxiliary Bias Rail
7.2.3
Without an Auxiliary Bias
7.3
Power Supply Recommendations
7.4
Layout
7.4.1
Layout Guidelines
7.4.1.1
Power Dissipation
7.4.1.2
Thermal Considerations
7.4.2
Layout Example
8
Device and Documentation Support
8.1
Documentation Support
8.1.1
Related Documentation
8.1.2
Device Nomenclature
8.2
Device Support
8.2.1
Development Support
8.2.1.1
Evaluation Modules
8.2.1.2
Spice Models
8.3
接收文档更新通知
8.4
支持资源
8.5
Trademarks
8.6
静电放电警告
8.7
术语表
9
Revision History
10
Mechanical, Packaging, and Orderable Information
封装选项
机械数据 (封装 | 引脚)
RGR|20
MPQF239A
KTW|7
MPSF015
RGW|20
MPQF122C
散热焊盘机械数据 (封装 | 引脚)
RGR|20
QFND242E
RGW|20
QFND012L
订购信息
zhcsal3t_oa
zhcsal3t_pm
8.6
静电放电警告
静电放电 (ESD) 会损坏这个集成电路。德州仪器 (TI) 建议通过适当的预防措施处理所有集成电路。如果不遵守正确的处理和安装程序,可能会损坏集成电路。
ESD 的损坏小至导致微小的性能降级,大至整个器件故障。精密的集成电路可能更容易受到损坏,这是因为非常细微的参数更改都可能会导致器件与其发布的规格不相符。