ZHCSKA4B December   2008  – September 2019 TPS737-Q1

PRODUCTION DATA.  

  1. 1 特性
  2. 2 应用
  3. 3 说明
    1.     Device Images
      1.      典型应用电路
  4. 4 修订历史记录
  5. 5 Pin Configuration and Functions
    1.     Pin Functions
  6. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
    6. 6.6 Typical Characteristics
  7. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagrams
    3. 7.3 Feature Description
      1. 7.3.1 Output Noise
      2. 7.3.2 Internal Current Limit
      3. 7.3.3 Enable Pin and Shutdown
      4. 7.3.4 Reverse Current
      5. 7.3.5 Thermal Protection
    4. 7.4 Device Functional Modes
  8. 8 Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Application
      1. 8.2.1 Design Requirements
      2. 8.2.2 Detailed Design Procedure
        1. 8.2.2.1 Input and Output Capacitor Requirements
        2. 8.2.2.2 Dropout Voltage
        3. 8.2.2.3 Transient Response
      3. 8.2.3 Application Curves
  9. 9 Power Supply Recommendations
  10. 10Layout
    1. 10.1 Layout Guidelines
      1. 10.1.1 Improve PSRR and Noise Performance
      2. 10.1.2 Power Dissipation
    2. 10.2 Layout Example
  11. 11器件和文档支持
    1. 11.1 文档支持
      1. 11.1.1 相关文档
    2. 11.2 接收文档更新通知
    3. 11.3 社区资源
    4. 11.4 商标
    5. 11.5 静电放电警告
    6. 11.6 Glossary
  12. 12机械、封装和可订购信息
    1. 12.1 封装

封装选项

机械数据 (封装 | 引脚)
散热焊盘机械数据 (封装 | 引脚)
订购信息

6.4 Thermal Information

THERMAL METRIC(1) TPS737xx-Q1 UNIT
DRB (VSON)
8 PINS
RθJA Junction-to-ambient thermal resistance 52.2 °C/W
RθJC(top) Junction-to-case (top) thermal resistance 59.4 °C/W
RθJB Junction-to-board thermal resistance 19.3 °C/W
ψJT Junction-to-top characterization parameter 2 °C/W
ψJB Junction-to-board characterization parameter 19.3 °C/W
RθJC(bot) Junction-to-case (bottom) thermal resistance 11.8 °C/W
(1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application report.