SLVSI89 March   2026 TPS63820

PRODMIX  

  1.   1
  2. 1 Features
  3. 2 Applications
  4. 3 Description
  5. 4 Device Comparison Table
  6. 5 Pin Configuration and Functions
  7. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
    6. 6.6 Timing Requirements
    7. 6.7 Typical Characteristics
  8. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1  Control Scheme
        1. 7.3.1.1 Buck Operation
        2. 7.3.1.2 Boost Operation
        3. 7.3.1.3 Buck-Boost Operation
      2. 7.3.2  PFM Operation
      3. 7.3.3  Ultra-sonic Mode Operation
      4. 7.3.4  Forced-PWM Operation (FPWM)
      5. 7.3.5  Ramp-PWM Operation (RPWM)
      6. 7.3.6  Device Enable (EN)
      7. 7.3.7  Undervoltage Lockout (UVLO)
      8. 7.3.8  Soft Start
      9. 7.3.9  Dynamic Voltage Scaling
      10. 7.3.10 Protection Functions
        1. 7.3.10.1 Input Voltage Protection (IVP)
        2. 7.3.10.2 Output Voltage Protection (OVP)
        3. 7.3.10.3 Current Limit Mode and Overcurrent Protection
        4. 7.3.10.4 Output Short Circuit Protection (Hiccup)
        5. 7.3.10.5 Thermal Shutdown
      11. 7.3.11 Power Good
      12. 7.3.12 Load Disconnect
      13. 7.3.13 Output Discharge
    4. 7.4 Device Functional Modes
    5. 7.5 Programming
      1. 7.5.1 Serial Interface Description
      2. 7.5.2 Standard-, Fast-, and Fast-Mode Plus Protocol
      3. 7.5.3 I2C Update Sequence
  9. 8 Register Map
    1. 8.1 Register Description
      1. 8.1.1 Register Map
      2. 8.1.2 Register CONTROL (Register address: 0x01; Default: 0xE0 or 0x40)
      3. 8.1.3 Register STATUS (Register address: 0x02; Default: 0x00)
      4. 8.1.4 Register DEVID (Register address: 0x03; Default: 0x20)
      5. 8.1.5 Register VOUT1 (Register address: 0x04; Default: 0x54)
      6. 8.1.6 Register CONTROL2 (Register address: 0x06; Default: 0x08)
  10. 9 Application and Implementation
    1. 9.1 Application Information
    2. 9.2 Typical Applications
      1. 9.2.1 1.2V to 5.5V Output Power Supply
        1. 9.2.1.1 Design Requirements
        2. 9.2.1.2 Detailed Design Procedure
          1. 9.2.1.2.1 Inductor Selection
          2. 9.2.1.2.2 Output Capacitor Selection
          3. 9.2.1.2.3 Input Capacitor Selection
        3. 9.2.1.3 Application Curves
    3. 9.3 Power Supply Recommendations
    4. 9.4 Layout
      1. 9.4.1 Layout Guidelines
      2. 9.4.2 Layout Example
  11. 10Device and Documentation Support
    1. 10.1 Device Support
      1. 10.1.1 Development Support
      2. 10.1.2 Device Nomenclature
        1. 10.1.2.1 Third-Party Products Disclaimer
    2. 10.2 Documentation Support
      1. 10.2.1 Related Documentation
    3. 10.3 Receiving Notification of Documentation Updates
    4. 10.4 Support Resources
    5. 10.5 Trademarks
    6. 10.6 Electrostatic Discharge Caution
    7. 10.7 Export Control Notice
    8. 10.8 Glossary
  12. 11Revision History
  13. 12Mechanical, Packaging, and Orderable Information
    1.     82

封装选项

请参考 PDF 数据表获取器件具体的封装图。

机械数据 (封装 | 引脚)
  • YBG|15
散热焊盘机械数据 (封装 | 引脚)
订购信息

9.2.1.1 Design Requirements

This example uses the design parameters listed in Table 9-1.

Table 9-1 Design Parameters
DESIGN PARAMETERSYMBOLEXAMPLE VALUE
Input voltageVI2.0V to 5.5V
Output voltageVO1.2V to 5.5V
Output currentIOup to 4A (when VI ≥ 3.0V)
I2C bus voltageVBUS3.3V
I2C bus speedFast-mode (400kHz)