ZHCSPA9A november   2021  – may 2023 TPS62441 , TPS62442

PRODUCTION DATA  

  1.   1
  2. 1 特性
  3. 2 应用
  4. 3 说明
  5. 4 Revision History
  6. 5 Device Comparison Table
  7. 6 Pin Configuration and Functions
  8. 7 Specifications
    1. 7.1 Absolute Maximum Ratings
    2. 7.2 ESD Ratings
    3. 7.3 Recommended Operating Conditions
    4. 7.4 Thermal Information
    5. 7.5 Electrical Characteristics
    6. 7.6 Timing Requirements
    7. 7.7 Typical Characteristics
  9. 8 Parameter Measurement Information
    1. 8.1 Schematic
  10. 9 Detailed Description
    1. 9.1 Overview
    2. 9.2 Functional Block Diagram
    3. 9.3 Feature Description
      1. 9.3.1 Precise Enable (EN)
      2. 9.3.2 COMP/FSET
      3. 9.3.3 MODE/SYNC
      4. 9.3.4 Undervoltage Lockout (UVLO)
      5. 9.3.5 Power-Good Output (PG)
      6. 9.3.6 Thermal Shutdown
    4. 9.4 Device Functional Modes
      1. 9.4.1 Pulse Width Modulation (PWM) Operation
      2. 9.4.2 Power Save Mode Operation (PWM/PFM)
      3. 9.4.3 100% Duty-Cycle Operation
      4. 9.4.4 Current Limit and Short-Circuit Protection
      5. 9.4.5 Output Discharge
      6. 9.4.6 Soft Start
  11. 10Application and Implementation
    1. 10.1 Application Information
      1. 10.1.1 Programming the Output Voltage
      2. 10.1.2 External Component Selection
        1. 10.1.2.1 Inductor Selection
        2. 10.1.2.2 Capacitor Selection
          1. 10.1.2.2.1 Input Capacitor
          2. 10.1.2.2.2 Output Capacitor
    2. 10.2 Typical Application
      1. 10.2.1 Design Requirements
      2. 10.2.2 Detailed Design Procedure
      3. 10.2.3 Application Curves
    3. 10.3 Power Supply Recommendations
    4. 10.4 Layout
      1. 10.4.1 Layout Guidelines
      2. 10.4.2 Layout Example
  12. 11Device and Documentation Support
    1. 11.1 Device Support
      1. 11.1.1 第三方产品免责声明
    2. 11.2 Documentation Support
      1. 11.2.1 Related Documentation
    3. 11.3 接收文档更新通知
    4. 11.4 支持资源
    5. 11.5 Trademarks
    6. 11.6 静电放电警告
    7. 11.7 术语表
  13. 12Mechanical, Packaging, and Orderable Information

封装选项

机械数据 (封装 | 引脚)
散热焊盘机械数据 (封装 | 引脚)
订购信息

7.4 Thermal Information

THERMAL METRIC(1) TPS6244x TPS6244x UNIT
 (JEDEC)  (EVM)
14 PINS 14 PINS
RθJA Junction-to-ambient thermal resistance 68.7 53.9 °C/W
RθJC(top) Junction-to-case (top) thermal resistance 50.8 n/a °C/W
RθJB Junction-to-board thermal resistance 15.1 n/a °C/W
ΨJT Junction-to-top characterization parameter 3.5 1.9 °C/W
ΨJB Junction-to-board characterization parameter 14.9 20.1 °C/W
RθJC(bot) Junction-to-case (bottom) thermal resistance n/a n/a °C/W
(1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application report.