ZHCSBQ2A April   2014  – May 2014 TPS62095

PRODUCTION DATA.  

  1. 特性
  2. 应用范围
  3. 说明
  4. 修订历史记录
  5. Pin Configuration and Functions
  6. Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 Handling Ratings
    3. 6.3 Recommend Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
    6. 6.6 Typical Characteristics
  7. Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1 PWM Operation
      2. 7.3.2 Low Dropout Operation (100% Duty Cycle)
      3. 7.3.3 Power Save Mode Operation
    4. 7.4 Device Functional Modes
      1. 7.4.1 Soft Startup
      2. 7.4.2 Voltage Tracking
      3. 7.4.3 Short Circuit Protection (Hiccup-Mode)
      4. 7.4.4 Output Discharge Function
      5. 7.4.5 Power Good Output
      6. 7.4.6 Undervoltage Lockout
      7. 7.4.7 Thermal Shutdown
  8. Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Applications
      1. 8.2.1 2.5V to 5.5V Input, 1.8V Output Converter
        1. 8.2.1.1 Design Requirements
        2. 8.2.1.2 Detailed Design Procedure
          1. 8.2.1.2.1 Output Filter
          2. 8.2.1.2.2 Inductor Selection
          3. 8.2.1.2.3 Input and Output Capacitor Selection
          4. 8.2.1.2.4 Setting the Output Voltage
        3. 8.2.1.3 Application Performance Curves
      2. 8.2.2 2.5V to 5.5V Input, 1.2V Output Converter
      3. 8.2.3 3.0V to 5.5V Input, 2.6V Output Converter
      4. 8.2.4 5V Input, 3.3V Output Converter
  9. Power Supply Recommendations
  10. 10Layout
    1. 10.1 Layout Guidelines
    2. 10.2 Layout Example
    3. 10.3 Thermal Consideration
  11. 11器件和文档支持
    1. 11.1 器件支持
      1. 11.1.1 第三方产品免责声明
    2. 11.2 Trademarks
    3. 11.3 Electrostatic Discharge Caution
    4. 11.4 Glossary
  12. 12机械封装和可订购信息

封装选项

机械数据 (封装 | 引脚)
散热焊盘机械数据 (封装 | 引脚)
订购信息

11 器件和文档支持

11.1 器件支持

11.1.1 第三方产品免责声明

TI 发布的与第三方产品或服务有关的信息,不能构成与此类产品或服务或保修的适用性有关的认可,不能构成此类产品或服务单独或与任何 TI 产品或服务一起的表示或认可。

11.2 Trademarks

DCS-Control is a trademark of TI.

All other trademarks are the property of their respective owners.

11.3 Electrostatic Discharge Caution

esds-image

These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam during storage or handling to prevent electrostatic damage to the MOS gates.

11.4 Glossary

SLYZ022TI Glossary.

This glossary lists and explains terms, acronyms, and definitions.