SLVSBR3A May   2013  – June 2015 TPS61158

PRODUCTION DATA.  

  1. Features
  2. Applications
  3. Description
  4. Revision History
  5. Pin Configuration and Functions
  6. Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
    6. 6.6 EasyScale Timing Requirements
    7. 6.7 Typical Characteristics
  7. Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1 Soft Start-Up
      2. 7.3.2 Shutdown
      3. 7.3.3 Current Program
      4. 7.3.4 Undervoltage Lockout
      5. 7.3.5 Open LED Protection
      6. 7.3.6 Thermal Shutdown
    4. 7.4 Device Functional Modes
      1. 7.4.1 LED Brightness Dimming Mode Selection
        1. 7.4.1.1 PWM Brightness Dimming
          1. 7.4.1.1.1 Digital 1-Wire Brightness Dimming
          2. 7.4.1.1.2 Easyscale: 1-Wire Digital Dimming
  8. Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Application
      1. 8.2.1 Design Requirements
      2. 8.2.2 Detailed Design Procedure
        1. 8.2.2.1 Inductor Selection
        2. 8.2.2.2 Maximum Output Current
        3. 8.2.2.3 Input and Output Capacitor Selection
      3. 8.2.3 Application Curves
      4. 8.2.4 Additional Application Circuits
        1. 8.2.4.1 TPS61158 To Drive Up To 8 LEDs
        2. 8.2.4.2 TPS61158 to Drive up to 8 LEDs with RC Filter at VIN Pin
  9. Power Supply Recommendations
  10. 10Layout
    1. 10.1 Layout Guidelines
    2. 10.2 Layout Example
  11. 11Device and Documentation Support
    1. 11.1 Device Support
      1. 11.1.1 Third-Party Products Disclaimer
    2. 11.2 Community Resources
    3. 11.3 Trademarks
    4. 11.4 Electrostatic Discharge Caution
    5. 11.5 Glossary
  12. 12Mechanical, Packaging, and Orderable Information

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6 Specifications

6.1 Absolute Maximum Ratings

over operating free-air temperature range (unless otherwise noted)(1)
MIN MAX UNIT
Voltage range(2) VIN –0.3 6 V
VOUT, LX –0.3 30 V
FB, CTRL –0.3 7 V
Continuous power dissipation
Operating junction temperature –40 150 °C
Storage temperature, Tstg –65 150 °C
(1) Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
(2) All voltage values are with respect to network ground terminal.

6.2 ESD Ratings

VALUE UNIT
V(ESD) Electrostatic discharge Human-body model (HBM), per ANSI/ESDA/JEDEC JS-001(1) ±2000 V
Charged-device model (CDM), per JEDEC specification JESD22-C101(2) ±500
(1) JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process.
(2) JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process.

6.3 Recommended Operating Conditions

over operating free-air temperature range (unless otherwise noted)
MIN NOM MAX UNIT
VIN Input voltage 2.7 5.5 V
VOUT Output voltage VIN 29 V
IOUT Output load current 30 mA
L Inductor 10 22 µH
CI Input capacitor 1 10 µF
CO Output capacitor 0.47 2.2 µF
FPWM Input PWM signal frequency 20 100 kHz
TA Operating ambient temperature –40 85 °C
TJ Operating junction temperature –40 125 °C

6.4 Thermal Information

THERMAL METRIC(1) TPS61158 UNIT
DRV (WSON)
6 PINS
RθJA Junction-to-ambient thermal resistance 70.4 °C/W
RθJC(top) Junction-to-case (top) thermal resistance 94.8 °C/W
RθJB Junction-to-board thermal resistance 39.8 °C/W
ψJT Junction-to-top characterization parameter 2.5 °C/W
ψJB Junction-to-board characterization parameter 40.2 °C/W
RθJC(bot) Junction-to-case (bottom) thermal resistance 10.2 °C/W
(1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application report, SPRA953.

6.5 Electrical Characteristics

VIN = 3.6 V, CTRL = High, IFB current = 20 mA, IFB voltage = 200 mV, TA = –40°C to 85°C, typical values are at TA = 25°C (unless otherwise noted).
PARAMETER TEST CONDITIONS MIN TYP MAX UNIT
POWER SUPPLY
VIN Input voltage range 2.7 5.5 V
VIN_UVLO VIN undervoltage lockout threshold VIN ramp down 2.2 2.35 V
VIN ramp up 2.5 2.65
VIN_HYS VIN undervoltage lockout hysteresis 275 mV
IQ Operating quiescent current into VIN Device enable, no switching and no load (VFB = 0.4 V) 0.3 0.5 mA
Device enable, switching 750 kHz
and no load (VFB = 0 V)
0.5 1.65
ISD Shutdown current CTRL = GND 0.1 1 µA
CONTROL LOGIC AND TIMING
VH CTRL logic high voltage 1.2 V
VL CTRL logic Low voltage 0.4 V
RPD CTRL pin internal pull-down resistor VCTRL = 1.8 V 300
tSD CTRL pulse width to shutdown CTRL from high to low 3.5 ms
VOLTAGE AND CURRENT REGULATION
VREF Voltage feedback regulation voltage Duty = 100% 194 200 206 mV
IFB FB pin bias current VFB = 200 mV 2 µA
tREF VREF filter time constant 230 µs
POWER SWITCH AND DIODE
RDS(ON) N-channel MOSFET on-resistance VIN = 3.6 V, TA = 25°C,
IOUT = 100 mA
0.6 1 Ω
VF Power diode forward voltage IDIODE = 0.2 A 0.75 1 V
ILEAK_LX LX pin leakage current VLX = 28 V 0.1 2 µA
OSCILLATOR
ƒSW Oscillator frequency 600 750 900 kHz
Dmax Maximum duty cycle of boost switching VFB = 0 V, measured on the drive signal of the switch MOSFET 88% 94%
PROTECTION AND SOFT START
ILIM NMOS current limit VIN = 3.6 V, D = DMAX
TA = 0°C to 85°C
0.5 0.6 0.7 A
ILIM_Start Start up current limit 360 mA
tILIM_Start Time step for start up current limit 8 ms
VOVP Open LED protection threshold Tested at VOUT pin 27.5 28.2 29 V
VACKNL Acknowledge output voltage low Open drain, Rpullup = 15 kΩ to VIN 0.4 V
THERMAL SHUTDOWN
Tshutdown Thermal shutdown threshold 160 °C
Thys Thermal shutdown hysteresis 15 °C

6.6 EasyScale Timing Requirements

MIN NOM MAX UNIT
tes_detect EasyScale detection time(1), CTRL low 450 µs
tes_delay EasyScale detection delay 100 µs
tes_win EasyScale detection window time, measured from CTRL high 3.5 ms
tstart Start time of program stream 3.5 µs
tEOS End time of program stream 3.5 600 µs
tH_LB High time of low bit, Logic 0 3.5 300 µs
tL_LB Low time of low bit, Logic 0 2 × tH_LB 600 µs
tH_HB High time of high bit, Logic 1 2 × tL_HB 600 µs
tL_HB Low time of high bit, Logic 1 3.5 300 µs
tvalACK Acknowledge valid time (see(2)) 3.5 µs
tACKN Duration of acknowledge condition (see(2)) 900 µs
(1) To select EasyScale mode, the CTRL pin has to be low for more than tes_detect during tes_win
(2) Acknowledge condition active 0, this condition will only be applied in case the RFA bit is set. Open drain output, line needs to be pulled high by the host with resistor load.

6.7 Typical Characteristics

TPS61158 C001_slvsbr3.png
Figure 1. Efficiency vs Dimming Duty Cycle
TPS61158 C003_slvsbr3.png
Figure 3. Efficiency vs Dimming Duty Cycle
TPS61158 C002_slvsbr3.png
Figure 2. Efficiency vs Dimming Duty Cycle
TPS61158 C006_SLVSBR3.png
Figure 4. Switch Current Limit vs Duty Cycle
TPS61158 C007_SLVSBR3.png
Figure 5. Switch Current Limit vs Temperature
TPS61158 fig015_lvsbr3.gif
Figure 7. Open LED Protection
TPS61158 C004_slvsbr3.png
Figure 6. FB Voltage vs EasyScale Step