SLVSI80 March   2026 TPS552852

PRODUCTION DATA  

  1.   1
  2. 1 Features
  3. 2 Applications
  4. 3 Description
  5. 4 Pin Configuration and Functions
  6. 5 Specifications
    1. 5.1 Absolute Maximum Ratings
    2. 5.2 ESD Ratings
    3. 5.3 Recommended Operating Conditions
    4. 5.4 Thermal Information
    5. 5.5 Electrical Characteristics
    6. 5.6 Typical Characteristics
  7. 6 Detailed Description
    1. 6.1 Overview
    2. 6.2 Functional Block Diagram
    3. 6.3 Feature Description
      1. 6.3.1  VCC Power Supply
      2. 6.3.2  Mode/SYNC Pin Configuration
      3. 6.3.3  Input Undervoltage Lockout
      4. 6.3.4  Enable and Programmable UVLO
      5. 6.3.5  Soft Start
      6. 6.3.6  Shutdown
      7. 6.3.7  Switching Frequency
      8. 6.3.8  Inductor Current Limit
      9. 6.3.9  Internal Charge Path
      10. 6.3.10 Output Voltage Setting
      11. 6.3.11 Output Current Limit
      12. 6.3.12 Input Overvoltage Protection
      13. 6.3.13 Output Overvoltage Protection
      14. 6.3.14 Output Short-Circuit Protection
      15. 6.3.15 Thermal Shutdown
    4. 6.4 Device Functional Modes
      1. 6.4.1 PWM Mode
      2. 6.4.2 Power Save Mode
  8. 7 Application and Implementation
    1. 7.1 Application Information
    2. 7.2 Typical Application
      1. 7.2.1 Design Requirements
      2. 7.2.2 Detailed Design Procedure
        1. 7.2.2.1 Inductor Selection
        2. 7.2.2.2 Input Capacitor
        3. 7.2.2.3 Output Capacitor
        4. 7.2.2.4 Output Current Limit
        5. 7.2.2.5 Loop Stability
      3. 7.2.3 Application Curves
    3. 7.3 Power Supply Recommendations
    4. 7.4 Layout
      1. 7.4.1 Layout Guidelines
      2. 7.4.2 Layout Example
  9. 8 Device and Documentation Support
    1. 8.1 Device Support
      1. 8.1.1 Third-Party Products Disclaimer
    2. 8.2 Receiving Notification of Documentation Updates
    3. 8.3 Support Resources
    4. 8.4 Trademarks
    5. 8.5 Electrostatic Discharge Caution
    6. 8.6 Glossary
  10. 9 Revision History
  11. 10Mechanical, Packaging, and Orderable Information

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机械数据 (封装 | 引脚)
散热焊盘机械数据 (封装 | 引脚)

5.4 Thermal Information

THERMAL METRIC(1)VAL (WQFN-HR)VAL (WQFN-HR)UNIT
15 PINS15 PINS
StandardEVM (2)
RθJA Junction-to-ambient thermal resistance47.633°C/W
RθJC(top)Junction-to-case (top) thermal resistance

22.5

N/A°C/W
RθJBJunction-to-board thermal resistance

7.8

N/A°C/W
ΨJTJunction-to-top characterization parameter0.60.7°C/W
YJBJunction-to-board characterization parameter

6.7

11.1°C/W
RθJC(bot)Junction-to-case (bottom) thermal resistanceN/AN/A°C/W
(1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application note.
(2) Measured on TPS552852EVM, 4-layer, 2oz/1oz/1oz/2oz copper PCB.