SLVSA82F March   2011  – December 2014 TPS43330-Q1 , TPS43332-Q1

PRODUCTION DATA.  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
  4. 4 Revision History
  5. 5 Device Comparison Table
  6. 6 Pin Configuration and Functions
  7. 7 Specifications
    1. 7.1 Absolute Maximum Ratings
    2. 7.2 ESD Ratings
    3. 7.3 Recommended Operating Conditions
    4. 7.4 Thermal Information
    5. 7.5 Electrical Characteristics
    6. 7.6 Typical Characteristics
  8. 8 Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagram
    3. 8.3 Feature Description
      1. 8.3.1 Buck Controllers: Normal Mode PWM Operation
        1. 8.3.1.1 Frequency Selection and External Synchronization
        2. 8.3.1.2 Enable Inputs
        3. 8.3.1.3 Feedback Inputs
        4. 8.3.1.4 Soft-Start Inputs
        5. 8.3.1.5 Current Sensing and Current Limit With Foldback
        6. 8.3.1.6 Slope Compensation
        7. 8.3.1.7 Power-Good Outputs and Filter Delays
      2. 8.3.2 Boost Controller
      3. 8.3.3 Frequency-Hopping Spread Spectrum
      4. 8.3.4 Gate-Driver Supply (VREG, EXTSUP)
      5. 8.3.5 External P-Channel Drive (GC2) and Reverse-Battery Protection
      6. 8.3.6 Undervoltage Lockout and Overvoltage Protection
      7. 8.3.7 Thermal Protection
    4. 8.4 Device Functional Modes
      1. 8.4.1 Buck Controllers: Current-Mode Operation
      2. 8.4.2 Buck Controllers: Light-Load PFM Mode
  9. 9 Application and Implementation
    1. 9.1 Application Information
    2. 9.2 Typical Application
      1. 9.2.1 Design Requirements
      2. 9.2.2 Detailed Design Procedure
        1. 9.2.2.1  Boost Component Selection
        2. 9.2.2.2  Boost Maximum Input Current IIN_MAX
        3. 9.2.2.3  Boost Inductor Selection, L
        4. 9.2.2.4  Inductor Ripple Current, IRIPPLE
        5. 9.2.2.5  Peak Current in Low-Side FET, IPEAK
        6. 9.2.2.6  Right Half-Plane Zero RHP Frequency, fRHP
        7. 9.2.2.7  Output Capacitor, COUTx
        8. 9.2.2.8  Bandwidth of Boost Converter, fC
        9. 9.2.2.9  Output Ripple Voltage Due to Load Transients, ∆VOUTx
        10. 9.2.2.10 Selection of Components for Type II Compensation
        11. 9.2.2.11 Input Capacitor, CIN
        12. 9.2.2.12 Output Schottky Diode D1 Selection
        13. 9.2.2.13 Low-Side MOSFET (BOT_SW3)
        14. 9.2.2.14 BuckA Component Selection
          1. 9.2.2.14.1 BuckA Component Selection
          2. 9.2.2.14.2 Current-Sense Resistor RSENSE
        15. 9.2.2.15 Inductor Selection L
        16. 9.2.2.16 Inductor Ripple Current IRIPPLE
        17. 9.2.2.17 Output Capacitor COUTA
        18. 9.2.2.18 Bandwidth of Buck Converter fC
        19. 9.2.2.19 Selection of Components for Type II Compensation
        20. 9.2.2.20 Resistor Divider Selection for Setting VOUTA Voltage
        21. 9.2.2.21 BuckB Component Selection
        22. 9.2.2.22 Resistor Divider Selection for Setting VOUT Voltage
        23. 9.2.2.23 BuckX High-Side and Low-Side N-Channel MOSFETs
      3. 9.2.3 Application Curves
  10. 10Power Supply Recommendations
  11. 11Layout
    1. 11.1 Layout Guidelines
      1. 11.1.1 Boost Converter
      2. 11.1.2 Buck Converter
      3. 11.1.3 Other Considerations
    2. 11.2 Layout Example
    3. 11.3 Power Dissipation Derating Profile, 38-Pin HTTSOP PowerPAD™ Package
  12. 12Device and Documentation Support
    1. 12.1 Third-Party Products Disclaimer
    2. 12.2 Related Links
    3. 12.3 Trademarks
    4. 12.4 Electrostatic Discharge Caution
    5. 12.5 Glossary
  13. 13Mechanical, Packaging, and Orderable Information

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机械数据 (封装 | 引脚)
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订购信息

1 Features

  • Qualified for Automotive Applications
  • AEC-Q100 Qualified With the Following Results:
    • Device Temperature Grade 1: –40°C to 125°C Ambient Operating Temperature
    • Device HBM ESD Classification Level 2
    • Device CDM ESD Classification Level C4B
  • Two Synchronous Buck Controllers
  • One Pre-Boost Controller
  • Input Range up to 40 V, (Transients up to 60 V), Operation Down to 2 V When Boost is Enabled
  • Low-Power-Mode IQ: 30 µA (One Buck On), 35 µA (Two Bucks On)
  • Low Shutdown Current Ish < 4 µA
  • Buck Output Range 0.9 V to 11 V
  • Boost Output Selectable: 7 V, 10 V, or 11 V
  • Programmable Frequency and External Synchronization Range 150 kHz to 600 kHz
  • Separate Enable Inputs (ENA, ENB)
  • Frequency Spread Spectrum (TPS43332)
  • Selectable Forced Continuous Mode or Automatic Low-Power Mode at Light Loads
  • Sense Resistor or Inductor DCR Sensing
  • Out-of-Phase Switching Between Buck Channels
  • Peak Gate-Drive Current 1.5 A
  • Thermally Enhanced 38-Pin HTSSOP (DAP) PowerPAD™ Package

2 Applications

  • Automotive Start-Stop, Infotainment, Navigation Instrument Cluster Systems
  • Industrial and Automotive Multi-Rail DC Power Distribution Systems and Electronic Control Units

3 Description

The TPS43330-Q1 and TPS43332-Q1 devices (TPS4333x-Q1) include two current-mode synchronous buck controllers and a voltage-mode boost controller. The TPS4333x-Q1 family of devices is ideally suited as a pre-regulator stage with low IQ requirements and for applications that must survive supply drops due to cranking events. The integrated boost controller allows the devices to operate down to 2 V at the input without seeing a drop on the buck regulator output stages. At light loads, the buck controllers can be enabled to operate automatically in low-power mode, consuming just 30 µA of quiescent current.

The buck controllers have independent soft-start capability and power-good indicators. Current foldback in the buck controllers and cycle-by-cycle current limitation in the boost controller provide external MOSFET protection. The switching frequency can be programed over 150 kHz to 600 kHz or synchronized to an external clock in the same range. Additionally, the TPS43332-Q1 device offers frequency-hopping spread-spectrum operation.

Device Information(1)

PART NUMBER PACKAGE BODY SIZE (NOM)
TPS43330-Q1 HTSSOP (38) 12.50 mm × 6.20 mm
TPS43332-Q1
  1. For all available packages, see the orderable addendum at the end of the datasheet.

Typical Application Diagram

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4 Revision History

Changes from E Revision (April 2013) to F Revision

  • Added ESD Ratings table, Feature Description section, Device Functional Modes, Application and Implementation section, Power Supply Recommendations section, Layout section, Device and Documentation Support section, and Mechanical, Packaging, and Orderable Information sectionGo

Changes from D Revision (September 2012) to E Revision

  • Revised descriptions for DIV, ENA, and ENB pinsGo
  • Revised DC Electrical Characteristics, items 4.2, 4.4, and 4.6Go
  • Replaced typical characteristic curve: LOAD STEP RESPONSE (BOOST) (0 TO 5 A AT 10 A/µs)Go
  • Altered functional block diagramGo
  • Revised last paragraph of Light-Load PFM Mode sectionGo
  • Revised schematic for Application Example 1Go
  • Changed R1 + R2... equation in Resistor Divider Selection... sectionGo

Changes from C Revision (July 2012) to D Revision

  • Changed specification names for HBM and CDM classification ratingsGo
  • Corrected TYP value for Vsense in Electrical Characteristics Go
  • Corrected capacitor valueGo

Changes from B Revision (July 2012) to C Revision