ZHCSFH8D August   2016  – January 2018 TPS25741 , TPS25741A

UNLESS OTHERWISE NOTED, this document contains PRODUCTION DATA.  

  1. 特性
  2. 应用
  3. 说明
    1.     Device Images
      1.      DFP 主机端口中的简化实施方案
  4. 修订历史记录
  5. Device Comparison Table
  6. Pin Configuration and Functions
    1.     Pin Functions
  7. Specifications
    1. 7.1 Absolute Maximum Ratings
    2. 7.2 ESD Ratings
    3. 7.3 Recommended Operating Conditions
    4. 7.4 Thermal Information
    5. 7.5 Electrical Characteristics
    6. 7.6 Timing Requirements
    7. 7.7 Switching Characteristics
    8. 7.8 Typical Characteristics
  8. Detailed Description
    1. 8.1 Overview
      1. 8.1.1 VBUS Capacitance
      2. 8.1.2 USB Data Communications
    2. 8.2 Functional Block Diagram
    3. 8.3 Feature Description
      1. 8.3.1  USB Type-C CC Logic (CC1, CC2)
      2. 8.3.2  9.3.2 VCONN Supply (VCONN, CC1, CC2)
      3. 8.3.3  USB Power Delivery BMC Transmission (CC1, CC2, VTX)
      4. 8.3.4  USB Power Delivery BMC Reception (CC1, CC2)
      5. 8.3.5  Discharging (DSCG, VPWR)
        1. 8.3.5.1 Discharging after a Fault (VPWR)
      6. 8.3.6  Configuring Voltage Capabilities (HIPWR, EN9V, EN12V)
      7. 8.3.7  Configuring Power Capabilities (PSEL, PCTRL, HIPWR)
      8. 8.3.8  Gate Drivers
        1. 8.3.8.1 GDNG, GDNS
        2. 8.3.8.2 G5V
        3. 8.3.8.3 GDPG
      9. 8.3.9  Fault Monitoring and Protection
        1. 8.3.9.1 Over/Under Voltage (VBUS)
        2. 8.3.9.2 Over-Current Protection (ISNS, VBUS)
        3. 8.3.9.3 System Fault Input (GD, VPWR)
      10. 8.3.10 Voltage Control (CTL1, CTL2)
      11. 8.3.11 Sink Attachment Indicator (UFP, DVDD)
      12. 8.3.12 Accessory Attachment Indicator (AUDIO, DEBUG)
      13. 8.3.13 Plug Polarity Indication (POL)
      14. 8.3.14 Power Supplies (VAUX, VDD, VPWR, DVDD)
      15. 8.3.15 Grounds (AGND, GND)
      16. 8.3.16 Output Power Supply (DVDD)
    4. 8.4 Device Functional Modes
      1. 8.4.1 Sleep Mode
      2. 8.4.2 Checking VBUS at Start Up
  9. Application and Implementation
    1. 9.1 Application Information
      1. 9.1.1 System-Level ESD Protection
      2. 9.1.2 Use of GD Internal Clamp
      3. 9.1.3 Resistor Divider on GD for Programmable Start Up
      4. 9.1.4 Selection of the CTL1 and CTL2 Resistors (RFBL1 and RFBL2)
      5. 9.1.5 Voltage Transition Requirements
      6. 9.1.6 VBUS Slew Control using GDNG CSLEW
      7. 9.1.7 Tuning OCP Using RF and CF
    2. 9.2 Typical Applications
      1. 9.2.1 A/C Multiplexing Power Source
        1. 9.2.1.1 Design Requirements
        2. 9.2.1.2 Detailed Design Procedure
          1. 9.2.1.2.1 Power Pin Bypass Capacitors
          2. 9.2.1.2.2 Non-Configurable Components
          3. 9.2.1.2.3 Configurable Components
        3. 9.2.1.3 Application Curves
      2. 9.2.2 D/C Power Source
        1. 9.2.2.1 Design Requirements
        2. 9.2.2.2 Detailed Design Procedure
          1. 9.2.2.2.1 Power Pin Bypass Capacitors
          2. 9.2.2.2.2 Non-Configurable Components
          3. 9.2.2.2.3 Configurable Components
        3. 9.2.2.3 Application Curves
    3. 9.3 System Examples
      1. 9.3.1 A/C Power Source (Wall Adapter)
      2. 9.3.2 Dual-Port Power Managed A/C Power Source (Wall Adapter)
  10. 10Power Supply Recommendations
    1. 10.1 VDD
    2. 10.2 VCONN
    3. 10.3 VPWR
  11. 11Layout
    1. 11.1 Layout Guidelines
      1. 11.1.1 Port Current Kelvin Sensing
      2. 11.1.2 Power Pin Bypass Capacitors
      3. 11.1.3 Supporting Components
    2. 11.2 Layout Example
  12. 12器件和文档支持
    1. 12.1 Documentation Support
    2. 12.2 相关链接
    3. 12.3 Receiving Notification of Documentation Updates
    4. 12.4 Community Resources
    5. 12.5 商标
    6. 12.6 静电放电警告
    7. 12.7 Glossary
  13. 13机械、封装和可订购信息

封装选项

机械数据 (封装 | 引脚)
散热焊盘机械数据 (封装 | 引脚)
订购信息

Configurable Components

  • CRX: Choose CRX between 200 pF and 600 pF. A 470 pF, 50 V, ±5% COG/NPO ceramic is recommended for both CC1 and CC2 pins.
  • Q1A/Q1B: For a 3-A application, an N-Channel MOSFET with RDS(on) in the 10 mΩ range is sufficient. BVDSS should be rated for 30 V for applications delivering 20 V, and 25 V for 12 V applications. For this application, the TI CSD17579Q3A (SLPS527) NexFET™ is suitable.
  • DQ1B: During the dead time between Q1B open and Q2 closed, 5V current is sourced onto VBUS through the body diode of Q1B with a small voltage drop. To reduce the voltage drop, an external Schottky can be added in parallel with Q1B.
  • Q2A/Q2B: For a 3-A application, an P-Channel MOSFET with RDS(on) in the 10 mΩ range is sufficient. BVDSS should be rated for 30 V for applications delivering 20 V and 20 V for 12 V applications. For this application, the TI CSD25404Q3 (SLPS570) NexFET™ is suitable.
  • RS: TPS25741 or TPS25741A OCP set point thresholds are targeted towards a 5 mΩ, ±1% sense resistor. Power dissipation for RS at 3 A load is approximately 45 mW.
  • RDSCG: The minimum value of RDSCG is chosen based on the application VBUS(max) and IDSCGT. For VBUS(max) = 12 V and IDSCGT = 350 mA, RDSCG(min) = 34.3 Ω. The size of the external resistor can then be chosen based on the capacitive load that needs to be discharged and the maximum allowed discharge time of 265 ms. Typically, a 120 Ω, 0.5 W resistor provides suitable performance.
  • RF/CF: Provide filtering of both ripple and transients. For this example, RF is a 24 Ω, 5% resistor and CF is a 0.33 μF, ceramic capacitor.
  • CPDIN: The requirement for CPDIN is 10 µF maximum. A 6.8 µF, 25 V, ±10% X5R or X7R ceramic capacitor is suitable for most applications.
  • DVBUS: DVBUS provides reverse transient protection during large transient conditions when inductive loads are present. A Schottky diode with a VRRM rating of 30 V in a SMA package such as the B340A-13-F provides suitable reverse voltage clamping performance.
  • CSLEW: To achieve a slew rate from zero to 5 V of less than 30 mV/µs using the typical GDNG current of 20 µA then CSLEW (nF) > 20 µA/30 mV/µs = 0.67 nF be used. Choosing CSLEW = 10 nF yields a ramp rate of 2 mV/µs.
  • RFBL1/RFBL2: Not used
  • CSLU/CSLL: Not used
  • RPPU: RPPU is the Q2 gate drive pullup resistor. The TPS25741 applies a sink current of 40 µA typical to turn on Q2 and RPPU should be large enough to fully enhance Q2 but not too large as it also discharges CSLP during turn off. The CSD25404Q3 lists an acceptable RDS(on) with VGS = -4.5V and ID = -10A. Using IGMV(min) = 34 µA and VGS = -4.5V yields R PPU = 132kΩ. Use a standard 1% resistor = 133kΩ resistor for RPPU.
  • CSLP: CSLP provides slew rate and inrush current limiting from the 12 V supply during VBUS transition from 5 V to 12 V. While the sink is attached, there could be as much as 110 µF on VBUS. The slew time must be > 233 µs and the inrush current must be < 3.85 A (VITRIP(min)/RS). For this design, target an inrush current of 2 A during 5 V to 12 V slew. The charge rate across CSLP will be the same as for the 110 µF load capacitor such that ILOAD/CLOAD = ICSLP/CSLP. Using the CSD25404Q3 Gate Charge curve, a plateau threshold voltage of VPTH ~ 1.8 V can be used to calculate CSLP with the equations below.
  • Equation 13. TPS25741 TPS25741A eq12_slvsdj5.gif
    Equation 14. CLOAD = 110 µF, IGDPG = 40 µA, VPTH = 1.8V, RPPU = 133 kΩ, ILOAD = 2 A
    Equation 15. TPS25741 TPS25741A eq13_slvsdj5.gif

    Choose CSLP = 1.5 nF

    Equation 16. TPS25741 TPS25741A eq14_slvsdj5.gif
  • CPPU: CPPU contributes a small Q2 turn on delay just prior to the 5 V to 12 V transition, but the primary function is to inhibit Q2 output turn on during ramp up of the 12 V power supply. When the 12 V power supply is OFF CSLP will be discharged. As the 12 V power supply ramps up, the common sources of Q2 will rise and CSLP will be charged through RPPU. CPPU is required to prevent Q2 VGS from exceeding the turn on threshold and prematurely charging VBUS for the case where the 12V bus ramps up quickly. CPPU and CSLP form a capacitive divider network with VGS(th) ≈ 12 V x CSLP / (CSLP + CPPU). Choose CPPU ≈ (12 V/VGS(th) –1) x CSLP. For this example, VGS(th) = 0.9 V and CPPU = 18 nF. If the 12 V power supply is enabled while the 5 V supply is on then CPPU can be smaller set by the voltage difference between the 12 V and 5 V supply. Always validate the final design on the test bench.
  • For faster fault turn off, Q3 can be connected as shown in Figure 51 and triggered using the GDNG pin. Q3 must have a ±20V VGS(max) rating for 20 V muxing applications.
  • TPS25741 TPS25741A Fast_turnoff_cir_slvsdj5.gifFigure 51. Fast Turnoff Circuit
  • Power Supply ON/OFF Considerations: For applications that can disable one or both of the power supplies, additional considerations apply. Refer to the TPS25741EVM-802 User Guide (refer to Documentation Support). for more information.