ZHCSDD9A November   2014  – February 2015 TPS22968-Q1

PRODUCTION DATA.  

  1. 1 特性
  2. 2 应用
  3. 3 说明
  4. 4 修订历史记录
  5. 5 Pin Configuration and Functions
  6. 6 Specifications
    1. 6.1  Absolute Maximum Ratings
    2. 6.2  ESD Ratings
    3. 6.3  Recommended Operating Conditions
    4. 6.4  Thermal Information
    5. 6.5  Electrical Characteristics (VBIAS = 5 V)
    6. 6.6  Electrical Characteristics (VBIAS = 3.3 V)
    7. 6.7  Electrical Characteristics (VBIAS = 2.5 V)
    8. 6.8  Switching Characteristics
    9. 6.9  Typical DC Characteristics
    10. 6.10 Typical AC Characteristics
  7. 7 Parameter Measurement Information
  8. 8 Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagram
    3. 8.3 Feature Description
      1. 8.3.1 ON/OFF Control
      2. 8.3.2 Quick Output Discharge (QOD)
      3. 8.3.3 Adjustable Rise Time
    4. 8.4 Device Functional Modes
  9. 9 Application and Implementation
    1. 9.1 Application Information
      1. 9.1.1 Input Capacitor (Optional)
      2. 9.1.2 Output Capacitor (Optional)
      3. 9.1.3 VIN and VBIAS Voltage Range
        1. 9.1.3.1 Parallel Configuration
        2. 9.1.3.2 Standby Power Reduction
        3. 9.1.3.3 Power Supply Sequencing Without a GPIO Input
        4. 9.1.3.4 Reverse Current Blocking
    2. 9.2 Typical Application
      1. 9.2.1 Design Requirements
      2. 9.2.2 Detailed Design Procedure
        1. 9.2.2.1 Inrush Current
      3. 9.2.3 Application Curves
  10. 10Power Supply Recommendations
  11. 11Layout
    1. 11.1 Layout Guidelines
    2. 11.2 Layout Example
    3. 11.3 Thermal Considerations
  12. 12器件和文档支持
    1. 12.1 商标
    2. 12.2 静电放电警告
    3. 12.3 术语表
  13. 13机械封装和可订购信息

封装选项

机械数据 (封装 | 引脚)
散热焊盘机械数据 (封装 | 引脚)
订购信息

10 Power Supply Recommendations

The device is designed to operate from a VBIAS range of 2.5 to 5.5 V and VIN range of 0.8 to 5.5 V. This supply must be well regulated and placed as close to the device pin as possible with the recommended 1-µF bypass capacitor. If the supply is located more than a few inches from the device pins, additional bulk capacitance may be required in addition to the ceramic bypass capacitors. If additional bulk capacitance is required, an electrolytic, tantalum, or ceramic capacitor of 10 µF may be sufficient.