SLIS110C April   2003  – March 2015 TPIC8101

PRODUCTION DATA.  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
  4. 4 Revision History
  5. 5 Description (continued)
  6. 6 Pin Configuration and Functions
  7. 7 Specifications
    1. 7.1 Absolute Maximum Ratings
    2. 7.2 ESD Ratings
    3. 7.3 Recommended Operating Conditions
    4. 7.4 Thermal Information
    5. 7.5 Electrical Characteristics
    6. 7.6 Timing Requirements
    7. 7.7 Typical Characteristics
  8. 8 Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagram
    3. 8.3 Feature Description
      1. 8.3.1 Functional Terminal Description
        1. 8.3.1.1  Supply Voltage (VDD)
        2. 8.3.1.2  Ground (GND)
        3. 8.3.1.3  Reference Supply (Vref)
        4. 8.3.1.4  Buffered Integrator Output (OUT)
        5. 8.3.1.5  Integration/Hold Mode Selection (INT/HOLD)
        6. 8.3.1.6  Chip Select for SPI (CS)
        7. 8.3.1.7  Oscillator Input (XIN)
        8. 8.3.1.8  Oscillator Output (XOUT)
        9. 8.3.1.9  Data Output (SDO)
        10. 8.3.1.10 Data Input (SDI)
        11. 8.3.1.11 Serial Clock (SCLK)
        12. 8.3.1.12 Test (TEST)
        13. 8.3.1.13 Feedback Output for Amplifiers (CH1FB and CH2FB)
        14. 8.3.1.14 Input Amplifiers (CH1P, CH1N, CH2P, and CH2N)
      2. 8.3.2 Timing Information
    4. 8.4 Device Functional Modes
      1. 8.4.1 System Transfer Equation
      2. 8.4.2 Programming in Normal Mode (TEST = 1)
      3. 8.4.3 Default SPI Mode
      4. 8.4.4 Advanced SPI Mode
      5. 8.4.5 Digital Data Output from the TPIC8101
    5. 8.5 Programming
      1. 8.5.1 Programming Examples
      2. 8.5.2 Programming in TEST Mode (TEST = 0)
  9. 9 Application and Implementation
    1. 9.1 Application Information
    2. 9.2 Typical Application
      1. 9.2.1 Design Requirements
      2. 9.2.2 Detailed Design Procedure
      3. 9.2.3 Application Curve
  10. 10Power Supply Recommendations
  11. 11Layout
    1. 11.1 Layout Guidelines
    2. 11.2 Layout Example
  12. 12Device and Documentation Support
    1. 12.1 Trademarks
    2. 12.2 Electrostatic Discharge Caution
    3. 12.3 Glossary
  13. 13Mechanical, Packaging, and Orderable Information

封装选项

机械数据 (封装 | 引脚)
散热焊盘机械数据 (封装 | 引脚)
订购信息

7 Specifications

7.1 Absolute Maximum Ratings

over operating free-air temperature range (unless otherwise noted) (1)
MIN MAX UNIT
VDD Regulated input voltage (2)(3) −0.3 7 V
VO Output voltage(2)(3) −0.3 7 V
VIN Input voltage(2)(3) −0.3 7 V
IIN DC input current on terminals CH1P, CH1N, CH2P, and CH2N(2)(3) 2 mA
VDCIN DC input voltage on terminals CH1P, CH1N, CH2P and CH2N(2)(3) 14 V
RθJA Junction-to-ambient thermal impedance 120 °C/W
PD Continuous power dissipation 200 mW
TA Operating ambient temperature –40 125 °C
Tstg Storage temperature –65 150 °C
(1) Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
(2) All voltage values are with respect to GND.
(3) Absolute negative voltage on these terminals is not to go < –0.5 V.

7.2 ESD Ratings

VALUE UNIT
V(ESD) Electrostatic discharge Human-body model (HBM)(1) 4000 V
Charged-device model (CDM) 1500
(1) The human body model is a 100-pF capacitor discharged through a 1.5-kΩ resistor into each terminal.

7.3 Recommended Operating Conditions

over operating free-air temperature range (unless otherwise noted)
MIN MAX UNIT
VDD Regulated input voltage −0.3 5.5 V
VO Output voltage −0.3 5.5 V
VIN Input voltage 0.05 VDD − 0.05 V
IIN DC input current on terminals CH1P, CH1N, CH2P, and CH2N –1 1 µA
VDCIN DC input voltage on terminals CH1P, CH1N, CH2P, and CH2N Vref, (VDD / 2) V
PD Continuous power dissipation 100 mW

7.4 Thermal Information

THERMAL METRIC(1) TPIC8101 UNIT
DW [SOIC]
20 PINS
RθJA Junction-to-ambient thermal resistance 66.2 °C/W
RθJC(top) Junction-to-case (top) thermal resistance 29.6
RθJB Junction-to-board thermal resistance 34.4
ψJT Junction-to-top characterization parameter 7.1
ψJB Junction-to-board characterization parameter 33.8
(1) For more information about traditional and new thermal metrics, see the IC Package Thermal Metrics application report, SPRA953.

7.5 Electrical Characteristics

VDD = 5 V ±5%, input frequency before prescaler = 4 to 20 MHz (±0.5%), TA = −40°C to 125°C (unless otherwise specified)
PARAMETER TEST CONDITIONS MIN TYP MAX UNIT
IDD(Q) Quiescent current VDD = 5 V 7.5 mA
IDD(OP) Operating current VDD = 5 V, XIN = 8 MHz 20 mA
Vmid0 Midpoint voltage VDD = 5 V, ISource = 2 mA 2.3 2.5 2.55 V
Vmid1 Midpoint voltage VDD = 5 V, ISink = 2 mA 2.4 2.5 2.7 V
Vmid2 Midpoint voltage VDD = 5 V, IL = 0 mA 2.4 2.5 2.6 V
Rpull0 Internal pullup resistor CS, SDI, SCLK, TEST VIN = GND 30 kΩ
Rpull1 Internal pulldown resistor INT/HOLD VIN = VDD 20 kΩ
Ilkg Input leakage current CS, SDI, SCLK, INT/HOLD, TEST Measured at GND and VDD,
VDD = 5.5 V = VIN		 ±3 µA
VIL Low-level input voltage INT/HOLD, CS, TEST, SDI, SCLK 30% of VDD
VIH High-level input voltage INT/HOLD, CS, TEST, SDI, SCLK 70% of VDD
VOL Low-level output voltage SDO ISink = 4 mA, VDD = 5V 0.7 V
VOH High-level output voltage SDO ISource = 100 µA, VDD = 5 V 4.4 V
Ilkg(OL) Low-level leakage current SDO Measured at GND and VDD = 5 V, SDO in high impedance −10 10 µA
VOL(XOUT) Low-level output voltage ISink = 500 µA, VDD = 4.5 V 1.5 V
VOH(XOUT) High-level output voltage ISource = 500 µA, VDD = 5 V 4.4 V
Vhyst Hysteresis voltage INT/HOLD, CS, XIN, SDI, SCLK, TEST 0.4 V
INPUT AMPLIFIERS
VOH(1) CH1FB and CH2FB high-level output voltage VDD = 5 V, ISource = 100 µA VDD – 0.05 VDD – 0.02 V
VDD = 5 V, ISource = 2 mA VDD – 0.5
VOL(1) CH1FB and CH2FB low-level output voltage ISink = 100 µA 15 50 mV
ISink = 2 mA 500
CATTEN Cross-coupling attenuation CH1FB and CH2FB ƒin max(ch1) = 20 kHz, measured on channel 2 40 dB
Av Open-loop gain 60 100 dB
GBW Gain bandwidth product Input range 0.5 to 4.5 V 1 2.6 MHz
VIN Input voltage range 0.05 VDD – 0.05 V
V(offset) Offset voltage at input −10 10 mV
CMRR Common-mode rejection ratio Inputs at Vmid ƒin = 0 to 20 kHz 60 80 dB
PM Phase margin Gain = 1, CL = 200 pF, RL = 100 kΩ 45 °
PRESCALER, XIN
VOSC Minimum input peak amplitude(1) VDD = Vmin, oscillator inverter biased feedback resistor 1 MΩ, ƒosc = 24 MHz 150 mV
CIN Input capacitance Assured by design 7 pF
Ilkg(XIN) Leakage current −1 1 µA
MULTIPLEXER
CATTEN Cross-coupling attenuation (assured by design) ƒin max(ch1) = 20 kHz, measured on channel 2 40 dB
ANTI-ALIASING FILTER
ƒc(2) Cut-off frequency at –3 dB 35 45 55 kHz
BW Response 1 to 20 kHz referenced to 1 kHz 70-mV RMS, input: CH1FB or CH2FB, output: OUT −1 −0.5 1 dB
ATTEN Attenuation at 100 kHz referenced to 1 kHz 70-mV RMS, input: CH1FB or CH2FB, output: OUT −10 −15 dB
ANALOG-TO-DIGITAL CONVERTER
ƒs Sampling frequency For all frequencies stated 198 200 202 kHz
AR Analog resolution 10 bit
ADNL Differential linearity error (DNL) 1 bit
AINL Linearity error (INL) 1 bit
DIGITAL-TO-ANALOG CONVERTER
ƒs(DA) Sampling frequency 198 200 202 kHz
DR Resolution at 200 kHz 10 bit
DDNL Differential linearity error (DNL) (Vreset < DACout < 0.98 VDD) −1 1 LSB
DINL Linearity error (INL) (Vreset < DACout < 0.98 VDD) −2.5 2.5 LSB
DRNIL Repeatability (for characterization purposes only) −1 1 LSB
OUTPUT BUFFER
VOH High-level output voltage VDD = 5 V, ISource = 2 mA VDD – 0.2 VDD – 0.15 V
VOL Low-level output voltage VDD = 5 V, ISink = 2 mA 120 175 mV
Av Open-loop gain IO = ±2 mA 60 100 dB
G Output gain IO = ±2 mA 1
Vripple Ripple voltage CL = 0 to 22 nF, max slew rate,
12 mV/µs from Vreset to 4 V		 10 mV
ts Settling time CL = 0 to 22 nF, max slew rate,
12 mV/µs from Vreset to 4 V, output: ±0.5 LSB		 20 µs
(1) 150-mV input amplitude on the 4-MHz clock input only applies if the feedback network is completed. Without the feedback network, the 4-MHz signal should be at 0- to 5-V levels.
(2) ƒc is programmable (see Table 3).

7.6 Timing Requirements

VDD = 5 V ±5%, TA = −40°C to 125°C (unless otherwise specified)
MIN NOM MAX UNIT
ƒSPI SPI frequency 5 MHz
t1 Time from CS falling edge to SCLK rising edge 10 ns
t2 Time from CS falling edge to SCLK falling edge 80 ns
t3 Time for SCLK to go high 60 ns
t4 Time for SCLK to go low 60 ns
t5 Time from last SCLK falling edge to CS rising edge 80 ns
t6 Time from SDI valid to falling edge of SCLK 60 ns
t7 Time for SDI valid after falling edge of SCLK 10 ns
t8 Time after CS rises until INT/HOLD to go high 8 ns
t9 Time between two words for transmitting 170 ns
t10 Time for SDO valid after SDI on bus, at VDD = 5 V and load = 20 pF 40 ns
TPIC8101 td_serial_periph_intf_slis110.gifFigure 1. Serial Peripheral Interface (SPI)

7.7 Typical Characteristics

TPIC8101 scr_amp_input_signal_slis110.gif
Figure 2. Amplified Input Signal Process
TPIC8101 scr_input_signal_proc_slis110.gif
Figure 3. Input Signal Processing