ZHCSQ23E October   2004  – May 2022 TPIC1021

PRODUCTION DATA  

  1. 1 特性
  2. 2 应用
  3. 3 说明
  4. 4 Revision History
  5. 5 说明（续）
  6. 6 Pin Configuration and Functions
  7. 7 Specifications
    1. 7.1 Absolute Maximum Ratings
    2. 7.2 ESD Ratings
    3. 7.3 Recommended Operating Conditions
    4. 7.4 Thermal Information
    5. 7.5 Electrical Characteristics
    6. 7.6 Timing Requirements
    7. 7.7 Typical Characteristics
  8. 8 Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagram
    3. 8.3 Feature Description
      1. 8.3.1 LIN Bus Pin
        1. 8.3.1.1 Transmitter Characteristics
        2. 8.3.1.2 Receiver Characteristics
      2. 8.3.2 Transmit Input Pin (TXD)
        1. 8.3.2.1 TXD Dominant State Timeout
      3. 8.3.3 Receive Output Pin (RXD)
        1. 8.3.3.1 RXD Wake-up Request
      4. 8.3.4 Ground (GND)
      5. 8.3.5 Enable Input Pin (EN)
      6. 8.3.6 NWake Input Pin (NWake)
      7. 8.3.7 Inhibit Output Pin (INH)
    4. 8.4 Device Functional Modes
      1. 8.4.1 Operating States
        1. 8.4.1.1 Normal Mode
        2. 8.4.1.2 Low Power Mode
        3. 8.4.1.3 Wake-Up Events
        4. 8.4.1.4 Standby Mode
      2. 8.4.2 Supply Voltage (VSUP)
  9. 9 Application and Implementation
    1. 9.1 Application Information
    2. 9.2 Typical Application
      1. 9.2.1 Design Requirements
      2. 9.2.2 Detailed Design Procedure
      3. 9.2.3 Application Curves
    3. 9.3 Power Supply Recommendations
    4. 9.4 Layout
      1. 9.4.1 Layout Guidelines
      2. 9.4.2 Layout Example
  10. 10Device and Documentation Support
    1. 10.1 接收文档更新通知
    2. 10.2 支持资源
    3. 10.3 Trademarks
    4. 10.4 Electrostatic Discharge Caution
    5. 10.5 术语表
  11. 11Mechanical, Packaging, and Orderable Information

封装选项

请参考 PDF 数据表获取器件具体的封装图。

机械数据 (封装 | 引脚)
  • D|8
散热焊盘机械数据 (封装 | 引脚)
订购信息

7.4 Thermal Information

THERMAL METRIC(1)TPIC1021UNIT
D (SOIC)
8 PINS
RθJAJunction-to-ambient thermal resistance145°C/W
RθJC(top)Junction-to-case (top) thermal resistance61.9°C/W
RθJBJunction-to-board thermal resistance55.5°C/W
ψJTJunction-to-top characterization parameter14.3°C/W
ψJBJunction-to-board characterization parameter55°C/W
(1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application report.