ZHCSD47E December   2014  – October 2022 TPD2E2U06-Q1

PRODUCTION DATA  

  1. 1 特性
  2. 2 应用
  3. 3 说明
  4. 4 Revision History
  5. 5 Pin Configuration and Functions
  6. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings—AEC Specification
    3. 6.3 ESD Ratings—IEC Specification
    4. 6.4 ESD Ratings—ISO Specification
    5. 6.5 Recommended Operating Conditions
    6. 6.6 Thermal Information
    7. 6.7 Electrical Characteristics
    8. 6.8 Typical Characteristics
  7. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1 AEC-Q101 Qualified
      2. 7.3.2 IEC 61000-4-2 Level 4
      3. 7.3.3 IO Capacitance
      4. 7.3.4 DC Breakdown Voltage
      5. 7.3.5 Ultra-Low Leakage Current
      6. 7.3.6 Low ESD Clamping Voltage
      7. 7.3.7 Industrial Temperature Range
      8. 7.3.8 Small Easy-to-Route Packages
    4. 7.4 Device Functional Modes
  8. 8 Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Application
      1. 8.2.1 Design Requirements
      2. 8.2.2 Detailed Design Procedure
        1. 8.2.2.1 Signal Range
        2. 8.2.2.2 Operating Frequency
      3. 8.2.3 Application Curve
  9. 9 Power Supply Recommendations
  10. 10Layout
    1. 10.1 Layout Guidelines
    2. 10.2 Layout Example
  11. 11Device and Documentation Support
    1. 11.1 Documentation Support
      1. 11.1.1 Related Documentation
    2. 11.2 接收文档更新通知
    3. 11.3 支持资源
    4. 11.4 Trademarks
    5. 11.5 Electrostatic Discharge Caution
    6. 11.6 术语表
  12. 12Mechanical, Packaging, and Orderable Information

封装选项

机械数据 (封装 | 引脚)
散热焊盘机械数据 (封装 | 引脚)
订购信息

4 Revision History

Changes from Revision D (May 2016) to Revision E (October 2022)

  • 更新了整个文档中的表格、图和交叉参考的编号格式Go
  • Updated the Surge Curve (tp = 8/20 μs) IO to GND figureGo

Changes from Revision C (March 2016) to Revision D (May 2016)

  • 更新了特性、应用 和说明 Go
  • 更新了 ESD 等级 - AEC 规格 表Go

Changes from Revision B (December 2014) to Revision C (March 2016)

  • 添加了 DCK 封装Go
  • 在热性能信息 表中添加了 DCK 热性能数据Go

Changes from Revision A (December 2014) to Revision B (December 2014)

  • Added temperature specification to VBR TEST CONDITIONS. Go

Changes from Revision * (December 2014) to Revision A (December 2014)

  • 完整文档的初始发行版Go